The Semiconductor and Electronic industries require High Purity materials to ensure product quality and stability. This makes the sputtering target materials industry an essential component of the electronic and semiconductor sectors. Metal targets are among the primary materials used in thin film production, and the purity and uniformity of these targets directly impact the quality and performance of the thin films. Therefore, high-quality targets are indispensable materials for the semiconductor and electronic industries.
Demand for high-purity metals
The electronics and semiconductor industries require high-purity materials to ensure product quality and consistency. Among these, thin-film solar cells and flat-panel displays require a purity of 4N, while integrated circuit chips require a purity of 6N.
Requirements for Target Manufacturing Technology
With the rapid development of the electronic and semiconductor industries, higher quality and performance requirements have been placed on target materials. The manufacturing of high-quality target materials requires advanced production technology and processes.
The methods primarily used for target material manufacturing are melting and powder metallurgy. Melting methods include vacuum induction melting, vacuum arc melting, and vacuum electron beam melting. After melting, the obtained ingots are mechanically processed to prepare the target materials. This method results in target materials with low impurity content, high density, scalability, and no internal porosity. However, if there is a significant difference in melting points and densities between the two alloys, it may not be possible to form a homogeneous alloy target material.
Powder metallurgy methods mainly include hot isostatic pressing, hot pressing, and cold pressing-sintering. These methods involve mixing various raw material powders and then sintering them to form the target materials. The advantages of this method are that the target material composition is relatively uniform and has good mechanical properties. However, the drawback is that it tends to have a higher oxygen content.
Target manufacturing process classification and advantages and disadvantages:
Target Manufacturing Process | Specific Method | Operating Method | Advantages | Disadvantages |
Powder Metallurgy Method | Hot Isostatic Pressing (HIP) | Powder or pre-formed embryos are pressurized and sintered under equal pressure at 800°C, 1400°C, and 1000kgf/cm2-2000kgf/cm2. | High density, good physical and mechanical properties | High investment in equipment, high production cost, high rate of oxygen deficiency of the product |
Hot Pressing | After filling a graphite or alumina mold with the appropriate powder, the mold is uniaxially pressurized at a pressure of 100kgf/cm2-1000kgf/cm2 and sintered at a temperature of 1,000°C to 1,600°C. The sintering process takes place at the same time. | Lower molding pressure required, lower sintering temperature, shorter sintering time | High oxygen deficiency rate, uneven distribution of oxygen content, and inability to produce large-size targets | |
Cold Pressing-Sintering | The raw material intervenes in the mixing of binder and dispersant, pressure molding, degreasing, and sintering at 1400℃-1600℃. | Low input, low cost, high product density, low oxygen deficiency, large size | High selectivity for powders | |
Melt Casting Method | Vacuum Induction Melting | During electromagnetic induction, an eddy current is generated which melts the metal. | No pores inside the target, small defects, low target gas impurity content, high density, can be large-scale | The density of the two alloys requires a high degree of similarity, if the melting point and density of the two metals differ greatly, it is difficult to obtain a uniform composition of the target material |
Vacuum Arc Melting | Melting of metals and alloys in a vacuum environment utilizing the heat of an electric arc. | |||
Vacuum Electron Beam Melting | In the high-vacuum chamber, the use of electron beams emitted by the electron gun to attack the molten charge is the kinetic energy of the electrons into thermal energy and melts the charge. |
Promotion of materials science
The target material industry is diversifying rapidly with the development of new materials such as non-crystalline metal, alloy, ceramic, and composite targets. These advancements are meeting the specific demands of various industrial sectors, particularly in electronics and semiconductors.
The semiconductor and electronic industries wield considerable influence over the trajectory of the target materials industry. This interdependence is poised to fuel ongoing innovation in material preparation technologies and cultivate new avenues for collaboration and advancement in the technological landscape.
Heeger Materials is a reputable supplier offering top-notch Semiconductor Materials and Sputtering Target products at competitive prices, which are widely used in semiconductor industries and science fields. If you're interested, feel free to reach out to us at [email protected] for a quote, and we guarantee a response within 24 hours.