Understanding how these fillers work and how they interact with the polymer matrix is crucial for engineers, material scientists, and thermal designers working in consumer electronics, power modules, and ceramic-based thermal systems.

This article provides a science-based review of how MIM works, why it is reshaping consumer electronics, and how metal powder characteristics—such as nitrogen-atomised stainless steel powders—define the performance and reliability of next-generation electronic devices.

This article offers a comprehensive understanding of why engineered ceramics outperform conventional materials in demanding applications.

This article provides a comprehensive comparison of CCL and DBC substrates, analyzing material properties, fabrication processes, applications, and future trends. By understanding their differences, engineers and designers can make informed decisions when selecting substrates for high-performance electronics.

This article examines the key aspects of selecting silicon nitride powder, including its properties, significance, grade variations, and its comparison with other ceramic powders. By the end, readers will understand not only the applications of silicon nitride powder but also how to evaluate its specifications for specific industrial needs.