The trend towards miniaturization and lightweight design in electronics presents challenges for thermal management. Research shows that a 2-degree Celsius rise in component temperature reduces reliability by 10%, with lifespans at 50°C dropping to one-sixth compared to room temperature. Temperature constraints continue to hinder the progress of new technologies.
Conductivity is vital in thermal management research
In thermal management research, material thermal conductivity is vital. High-conductivity materials efficiently transfer and absorb heat, ensuring device stability and enhancing efficiency. Materials like graphene, aluminum oxide, boron nitride coatings, and polymers with conductive fillers are advancing thermal management, offering industries efficient temperature control solutions.
Which material has high thermal conductivity?
A wide range of high thermal conductivity materials are being researched, falling into three main categories: metal-based, ceramic, and polymer-based materials. Each type offers unique advantages and applications, detailed below.
Metal-based thermal conductive materials
Metal is commonly used for its high strength, wear resistance, and ease of processing. While it has good thermal conductivity, there is potential for further enhancement to meet more demanding service conditions.
Naturally occurring thermal conductive metal materials：
Material | Thermal conductivity (W/m·K) | Feature |
Silver | 429 | Silver is a relatively inexpensive and abundant thermal conductor, making it one of the most widely used metals due to its ductility. |
Copper | 398 | Copper, with a high melting point and moderate corrosion rate, is the most commonly used metal in electrical manufacturing to minimize energy loss during heat transfer. |
Gold | 315 | Gold has excellent corrosion resistance, but due to its rarity and costliness, it is suitable for specific electrical conductivity applications. |
Aluminum | 247 | Aluminum, abundant and easy to work with, has a lower melting point and is commonly used as a cost-effective substitute for copper. |
173 | Tungsten, with a high melting point and low vapor pressure, is an ideal electrical material for applications exposed to high-intensity power. | |
Zinc | 116 | Zinc is one of the few metals that can easily combine with other metals to form metal alloys (mixtures of two or more metals). |
Ceramic thermal conductive materials
Ceramics like aluminum nitride, silicon nitride, and yttria-stabilized zirconia provide excellent thermal conductivity and have the potential to replace metals in various applications due to their high hardness, pressure resistance, and temperature tolerance.
Material | Thermal conductivity (W/m·K) | Feature |
310 | Aluminum nitride is one of the few materials with high thermal conductivity and electrical insulation properties, offering exceptional thermal shock resistance, and is often used as a beryllium oxide substitute. | |
Silicon Carbide | 270 | Silicon carbide is a semiconductor that is extremely hard and is commonly used in automotive brake discs, turbine engines, and composite materials. |
Polymer-based thermal conductive materials
High polymers, with molecular weights over ten thousand, are valued for their versatility, plasticity, and cost-effectiveness. Primarily used in electronics for shielding, insulation, and damping, their low thermal conductivity has driven research into polymer-based thermal materials.
The main approach is to enhance the overall thermal conductivity by compounding high thermal conductive materials into the polymer matrix.
- Surface-modified aluminum nitride with reinforced phenolic resin, compounded with EPDM rubber at a mass ratio of 1:4, showed a 44% increase in thermal conductivity compared to unmodified samples.
- Spherical aluminum oxide was utilized as a thermal conductivity enhancer in polyurethane composites, achieving a thermal conductivity of 2.51 W/(m • K) through optimized surface modification and proportion control of the thermal conductive filler.
Metals have the best thermal conductivity, with room for improvement through filler enhancement. Ceramic materials are evolving, while polymer composites lag in thermal conductivity. Research on high thermal conductive materials holds promise with advancing technologies and deeper material insights.
Heeger Materials is a reputable supplier offering various kinds of ceramics and semiconductor materials products at competitive prices, which are widely used in research and science fields. If you're interested, feel free to contact us at [email protected] for a quote, and we guarantee a response within 24 hours.