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Ceramic end effectors are used to carry products, such as wafer silicon wafers, which require thermal stability and can be used in high temperatures of more than 2,000 degrees without causing pollution. This is because alumina ceramics have the advantages of high temperature and wear resistance.
Critical analysis and characterization of 6 key ceramic material systems in ltcc technology
Posted by Blog - Technical Ceramics - Heeger Materials 0 Comments views (12)
In this article, we provide a critical analysis of six key ceramic material systems in LTCC technology, exploring their properties, classification, challenges, and future innovations.
Optimizing high-power chip performance with advanced thermal interface materials (200w–400w)
Posted by Blog - Technical Ceramics - Heeger Materials 0 Comments views (12)
This article explores what TIMs are, how they function, and why they are indispensable in high-power chip applications. It also compares different TIM types, highlights the role of ceramic-based fillers, and evaluates future trends in this evolving field.
Unlocking the potential of low-temperature sintered alumina ceramics in advanced electronics
Posted by Blog - Technical Ceramics - Heeger Materials 0 Comments views (45)
This article explores what low-temperature sintered alumina ceramics are, why they are important, the methods used to achieve them, and how they are applied in modern electronic devices.
Why fillers are the game-changer in thermal interface material performance
Posted by Blog - Technical Ceramics - Heeger Materials 0 Comments views (89)
Fillers transform Thermal Interface Materials by boosting thermal conductivity and reliability, making them critical for efficient heat dissipation in modern electronics.
Innovative approaches to producing high-performance zirconia ceramics
Posted by Blog - Technical Ceramics - Heeger Materials 0 Comments views (57)
This article explores innovative approaches to producing Y-ZrO2 ceramics with a focus on process parameters, performance comparison, and practical applications.