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New Gold-Tin Alloy Preformed Solder Ribbon/Sheet, Au80Sn20-Heeger Materials Inc View larger

Gold-Tin Alloy Preformed Solder Ribbon/Sheet, Au80Sn20

HM3060

New product

Gold-Tin Alloy Preformed Solder Ribbon/Sheet is designed for high-performance soldering applications that require excellent thermal fatigue resistance, high strength at elevated temperatures, and superior mechanical properties. HM offers customizable solutions for a wide range of electronic applications, including chip bonding and high-temperature devices.

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Data sheet

Thickcustomized
Density14.51 g/cm3
MaterialsAu80Sn20
Melting Piont280 °C

More info

Gold-Tin Alloy Preformed Solder Ribbon/Sheet has a melting point of 280°C (556°F), making it ideal for applications that demand a high melting point and exceptional thermal and mechanical performance. This alloy is widely used in situations where high tensile strength, corrosion resistance, and the ability to resist melting during low-temperature reflow processes are essential. Commonly applied in chip bonding, particularly for high-power devices, it ensures reliable connections without compromising thermal fatigue resistance. The preformed solder is available in sizes tailored to chip dimensions, typically 90-100% of the chip's X and Y dimensions. For optimal bonding, thin solder ribbons are preferred, provided they do not compromise reliability. The flatness of the preformed solder is crucial, as any warping may lead to chip misalignment during reflow, resulting in soldering failure. Heeger Material provides high-quality Gold-Tin Alloy Preformed Solder Ribbon/Sheet, designed for advanced electronic applications requiring durable and reliable connections.

Gold-Tin Alloy Preformed Solder Ribbon/Sheet, Au80Sn20

Gold-Tin Alloy Preformed Solder Ribbon/Sheet Properties

Material NameAu80Sn20
Solidus Temperature (°C)280
Liquidus Temperature (°C)280
Recommended Soldering Temperature (°C)>310
Density (g/cm³)14.51
Thermal Conductivity (W/m·°C)57
Coefficient of Thermal Expansion (×10⁻⁶/°C)16
Tensile Strength (MPa)276

Gold-Tin Alloy Preformed Solder Ribbon/Sheet Advantages

  • High-temperature strength, high-melting-point solder.
  • Corrosion resistance.
  • Compatibility with other noble metals.

Gold-Tin Alloy Preformed Solder Ribbon/Sheet Applications

  • Fiber Optic Connections: Used for metalized fiber optic connections, ensuring stable and reliable bonding.
  • Optoelectronic Sealing: Ideal for sealing covers of optoelectronic imaging devices.
  • Chip Bonding: Suitable for high-power chip bonding with strong, reliable joints.
  • Aerospace Soldering: Applied in high-temperature soldering for aerospace components.
  • Semiconductor Packaging: Used in semiconductor packaging for strong, high-temperature joints.

Gold-Tin Alloy Preformed Solder Ribbon/Sheet Packing 

The Gold-Tin Alloy Preformed Solder Ribbon/Sheet will be packaged according to the size and shape selected by the customer. The main packaging methods we offer include VR boxes, bottled packaging, reels, blue film, and taping. Each method is designed to ensure the safe transport of the product and avoid any damage during transit, guaranteeing its integrity and optimal condition upon arrival.

Gold-Tin Alloy Preformed Solder Ribbon/Sheet Packing

Where to Buy Gold-Tin Preformed Solder Ribbon/Sheet in Bulk?

Heeger Materials Inc., a professional supplier and manufacturer of high-quality Gold products, including Gold-Tin Alloy Preformed Solder Ribbon/Sheet, leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.

Heeger Materials Inc. was established in 2016 in Colorado, USA. We are a specialized supplier of premium-grade metals, alloys, ceramics, powders, and other materials catering to research, development, and large-scale industrial production in scientific and industrial sectors. 

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