Spherical Tungsten (W) Powder

Spherical Tungsten (W) Powder is characterized by its high density, elevated melting point, and excellent electrical conductivity, making it an ideal material for electrical and microelectronic applications. It is a raw material in industries including tungsten and tungsten alloy 3D printing, porous materials, and high-density powder spraying.

Spherical Tungsten (W) Powder Characteristics

• High purity (≥99.9%)
• Ultra-low oxygen (≤100ppm)
• High sphericity (≥98%)
• Smooth surface
• No satellite ball
• Uniform particle size distribution
• Excellent flow performance (≤6.0s/50g)
• High loose density (≥9.5g/cm3) and vibration density (≥11.5g/cm3)

Spherical Tungsten (W) Powder Applicable Process

• Laser/electron beam additive manufacturing (SLM/EBM)
• Laser direct deposition (DLD)
• Powder hot isostatic pressing (HIP)
• Metal injection molding (MIM)
• Powder metallurgy (PM)
• Laser cladding (LC)

Spherical Tungsten (W) Powder Application

• National Defense
• Military industry
• Medical equipment

Spherical Tungsten (W) Powder Chemical Composition

Spherical Tungsten (W) Powder Physical Characteristics

Particle Size Description

• 5-25μm (D10=5~10μm, D50=15~20μm, D90=20~25μm)
• 15-45μm (D10=15~20μm,D50=25~30μm,D90=35~40μm)
• 15-53μm (D10=15~20μm,D50=25~35μm,D90=45~50μm)
• 45-75μm (D10=45~55μm,D50=55~65μm,D90=70~75μm)
• 45-105μm (D10=50~60μm,D50=75~85μm,D90=95~105μm)
• 75-150μm (D10=80~90μm,D50=110~125μm,D90=135~150μm)

It is a single peak normal distribution, and the laser particle size distribution can be referred to in the following figure.

                                                       Particle Size Distribution

Spherical Tungsten (W) Powder Surface Topography

Spherical Tungsten (W) Powder Storage and Packaging

Spherical Tungsten (W) Powder should be stored in a sealed container in a dry and cool place, and should not be exposed to air for an extended period. HM offers vacuum-sealed packaging including 100g/bag, 500g/bag, 1kg/bag, and 25kg/drum, or customized packaging as per specific requirements.