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Indium-based Metallic...
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Indium-based Metallic Bonding
HTST1187
New product
Indium-based Metallic bonding utilizes an Indium Alloy and is rated to 150 degrees C. It provides good thermal and electrical conductivity and is recommended for most sputtering applications.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
More info
Why choose Indium bonding for your sputter targets?
Indium has the best thermal conductivity of all available bonds and is the most efficient at drawing heat away from the target. Indium is also more malleable than other bonding soldiers and is more forgiving. An Indium-based Metallic bond provides good thermal and electrical conductivity and is recommended for most sputtering applications.
Indium bonding Advantages
- The highest thermally conductive bond offered
- Thorough bond coverage
- Malleable solder allows for thermal expansion during sputtering
- Provides support for fragile target materials
- Compatible with a wide range of target materials
Specification of Indium bonding
Maximum Operating Temperature (°C) | 150° C |
Thermal Conductivity (W/mK) | 83 |
Coefficient of Thermal Expansion (K-1) | 32.1 x 10-6 |
Electrical Resistivity (ohm-cm) | 8 x 10-6 |
Bond Coverage | >95% |
Bond Line Thickness | 0.010" ± 0.003" |
Indium bonding Contents
The melting point of indium is 156.6°C so temperatures in excess of 150°C will cause the bond to melt and fail. Most materials can be indium bonded but there are a few exceptions, please choose the best bonding method for your sputtering targets.
Indium-based Metallic Bonding Selection Notes
Indium-based Metallic Bonding belongs to the sputtering target bonding service range and is selected for controlled material quality, application-specific specifications and reliable supply for research or production use. It is commonly used in sputtering target assembly, backing plate attachment, thermal contact improvement, stress management and vacuum deposition target preparation. When requesting a quote, confirm target material, target size, backing plate material, bonding method, operating power, thermal requirement, drawing, service condition and quantity.
Related Materials and Product Forms
For material comparison or adjacent product forms, browse all products, deposition materials, technical ceramics and Target Bonding Service.
FAQ
What target bonding details are needed? Please provide target material and size, backing plate material, preferred bonding method, operating power or thermal load, drawing and deposition tool requirements.
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