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Elastomer Bonding
Elastomer is an alternative bonding...
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Elastomer Bonding
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Elastomer is an alternative bonding method that touts a higher temperature capability over the indium bond. Elastomer bonds are recommended when customers are consistently melting indium bonds. The major advantages of Elastomer bonding are its low cure temperature (reducing internal bond stresses from thermal miss match) and high operation temperature (250 °C).
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Elastomer Bonding Advantages
- Low cure temperature
- High operation temperature (250 °C)
- Larger dimensions of sputtering target and backing plate
Elastomer bonding Specifications
Maximum Operating Temperature (°C) | 250 ° C |
Thermal Conductivity (W/mK) | 54 |
Coefficient of Thermal Expansion (K-1) | 2.2 x 10-4 |
Electrical Resistivity (ohm-cm) | 0.0476 |
Bond Coverage | >98% |
Bond Line Thickness | 0.010” – 0.025” |
Elastomer Bonding Targets
Aluminum Nitride Sputtering Target
Barium Strontium Titanate AKA BST (Ba0.5Sr0.5TiO3) Sputtering Target
Barium Titanate (BaTiO3) Sputtering Target
Bismuth (Bi) Sputtering Target
Cobalt Oxide (CoO) Sputtering Target
Lithium (Li) Sputtering Target
Lithium Orthophosphate (Li3PO4) Sputtering Target
Manganese (Mn) Sputtering Target
Selenium (Se) Sputtering Target
Strontium Titanate (SrTiO3) Sputtering Target
Tin Oxide (SnO2) Sputtering Target
Other Bonding Methods
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