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Elastomer Bonding

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Elastomer is an alternative bonding method that touts a higher temperature capability over the indium bond. Elastomer bonds are recommended when customers are consistently melting indium bonds. The major advantages of Elastomer bonding are its low cure temperature (reducing internal bond stresses from thermal miss match) and high operation temperature (250 °C).

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Elastomer Bonding Advantages

  • Low cure temperature
  • High operation temperature (250 °C)
  • Larger dimensions of sputtering target and backing plate

Elastomer bonding Specifications

Maximum Operating Temperature (°C)

250 ° C

Thermal Conductivity (W/mK)


Coefficient of Thermal Expansion (K-1)

2.2 x 10-4

Electrical Resistivity (ohm-cm)


Bond Coverage


Bond Line Thickness

0.010” – 0.025”

 Elastomer Bonding Targets

Aluminum Nitride Sputtering Target

Barium Strontium Titanate AKA BST (Ba0.5Sr0.5TiO3) Sputtering Target

Barium Titanate (BaTiO3) Sputtering Target

Bismuth (Bi) Sputtering Target

Cobalt Oxide (CoO) Sputtering Target

Indium (In) Sputtering Target

Lithium (Li) Sputtering Target

Lithium Orthophosphate (Li3PO4) Sputtering Target

Manganese (Mn) Sputtering Target

Selenium (Se) Sputtering Target

Strontium Titanate (SrTiO3) Sputtering Target

Tin Oxide (SnO2) Sputtering Target

Other Bonding Methods

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