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Elastomer Bonding
Elastomer is an alternative bonding...
Target Bonding Service
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Elastomer Bonding
HTST1188
New product
Elastomer is an alternative bonding method that touts a higher temperature capability over the indium bond. Elastomer bonds are recommended when customers are consistently melting indium bonds. The major advantages of Elastomer bonding are its low cure temperature (reducing internal bond stresses from thermal mismatch) and high operation temperature (250 °C).
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Elastomer Bonding Advantages
- Low cure temperature
- High operation temperature (250 °C)
- Larger dimensions of the sputtering target and backing plate
Elastomer bonding Specifications
Maximum Operating Temperature (°C) | 250 ° C |
Thermal Conductivity (W/mK) | 54 |
Coefficient of Thermal Expansion (K-1) | 2.2 x 10-4 |
Electrical Resistivity (ohm-cm) | 0.0476 |
Bond Coverage | >98% |
Bond Line Thickness | 0.010” – 0.025” |
Elastomer Bonding Targets
We highly recommend using elastic binding for the following target materials. The elastic binding provides improved adhesion and uniformity during deposition processes, ensuring better performance and consistency in the final coating. This method allows for more precise control over material properties, reducing the risk of cracking or delamination, especially under high-stress or temperature conditions. It is particularly beneficial for applications requiring long-term durability and reliability.
Aluminum Nitride Sputtering Target
Barium Strontium Titanate AKA BST (Ba0.5Sr0.5TiO3) Sputtering Target
Barium Titanate (BaTiO3) Sputtering Target
Bismuth (Bi) Sputtering Target
Cobalt Oxide (CoO) Sputtering Target
Lithium (Li) Sputtering Target
Lithium Orthophosphate (Li3PO4) Sputtering Target
Manganese (Mn) Sputtering Target
Selenium (Se) Sputtering Target
Strontium Titanate (SrTiO3) Sputtering Target
Tin Oxide (SnO2) Sputtering Target
Other Target Bonding Methods
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