Copper foam is a porous 3D structural material with good electrical and thermal conductivity and ductility, which can be used as a highly efficient heat-conducting and heat-dissipating component, electrode material for batteries, and catalyst carrier. HM offers various specifications and customized services according to specific requirements.

Heeger Materials also provides high-quality Tantalum (Ta) Foam, Aluminum (Al) Foam, Iron-nickel (Fe-Ni) Foam, Nickel (Ni) Foam, Titanium (Ti) Foam, Iron (Fe) Foam, etc.

Copper (Cu) Foam Specifications

Copper (Cu) Foam Applications

• Electrode materials
• Catalysts
• Thermal conductive materials
• Noise reduction and shielding materials
• Filter materials
• Fluid pressure buffer material

Copper (Cu) Foam Packing

Tantalum (Ta) Foam is carefully handled during storage and transportation to preserve the quality of our product in its original condition.