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Silver Bonding Wire View larger

Silver Bonding Wire

HM3020

New product

Silver Bonding Wire is made from high-purity silver with alloying treatment, offering stable structure and excellent electrical and thermal conductivity. Heeger Materials is a professional supplier and manufacturer of high-quality Silver Bonding Wire, offering customized solutions and competitive prices.

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Data sheet

MaterialsAg
Purity5N

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Silver Bonding Wire is produced using high-purity silver (≥99%) through specialized alloying and casting techniques to enhance stability, conductivity, and corrosion resistance. Its surface is treated with composite materials for better performance and reduced degradation caused by intermetallic compound diffusion, particularly between silver and aluminum. Compared to gold wire, silver bonding wire offers a more economical solution with competitive pricing, making it a reliable choice for IC, LED, and power device packaging. Heeger Materials provides high-quality Silver Bonding Wire with consistent performance for advanced electronic applications.

Silver Bonding Wire

Silver Bonding Wire Selection Notes

Silver Bonding Wire belongs to the microelectronic bonding wire range and is selected for controlled bonding-wire metal or alloy, diameter, tensile behavior, elongation, surface cleanliness and spool consistency. It is commonly used in semiconductor packaging, microelectronics, LED assemblies, power devices, hybrid circuits and wire-bonding process development. When requesting a quote, confirm metal or alloy, purity, wire diameter, tensile strength, elongation, spool size, surface or cleanliness requirement, packaging, certification and quantity.

Related Materials and Product Forms

For material comparison or adjacent product forms, browse precious metals, semiconductor materials, all products and silver product.

FAQ

What bonding-wire specifications are needed for Silver Bonding Wire? Please provide metal or alloy, purity, diameter, tensile and elongation requirements, spool format, surface cleanliness, certification, packaging, quantity and bonding process.

Silver Bonding Wire Characteristics

Type

YA1

YA2

YA3

YA4

Main Content

Ag ≥ 99.0%

Ag ≥ 95.0%

Ag ≥ 88.0%

Ag ≥ 85.0%

AuPd ≤ 1.0%

AuPd ≤ 5.0%

AuPd ≤ 12.0%

AuPd ≤ 15.0%

Characteristics

Low electrical resistivity

High thermal conductivity

Good fatigue resistance

Good corrosion resistance

High reliability

Silver Bonding Wire Mechanical Properties

Ø Diameter
±1% 

Breaking Load B/L(gf)

Elognation E/L(%)

μm

mil

YA1

YA2

YA3

YA4

YA

15±1

0.6

> 1.5

> 2

> 3

> 4

2 - 10

16±1

0.65

> 2

> 3

> 4

> 5

2 - 10

18±1

0.7

> 4

> 5

> 6

> 7

5 - 15

20±1

0.8

> 5

> 6

> 7

> 8

5 - 15

23±1

0.9

> 7

> 8

> 10

> 11

5 - 15

25±1

1.0

> 9

> 10

> 12

> 13

5 - 15

30±1

1.2

> 13

> 14

> 15

> 16

8 - 18

32±1

1.25

> 15

> 16

> 17

> 18

8 - 18

38±1

1.5

> 20

> 21

> 22

> 23

10 - 20

50±2

2.0

> 34

> 36

> 38

> 40

10 - 20

75±3

3.0

> 68

> 70

> 75

> 78

15 - 25

* HM can offer customized services upon specific requests.

Silver Bonding Wire Fusing Current & Hardness

Fusing Current (A,10mm)

Diameter (μm / mil)

YA1

YA2

YA3

YA4

18

0.7

0.38

0.35

0.32

0.30

20

0.8

0.49

0.45

0.42

0.39

23

0.9

0.62

0.57

0.53

0.48

25

1.0

0.76

0.70

0.64

0.61

30

1.2

1.07

0.99

0.91

0.89

38

1.5

1.66

1.54

1.42

1.37

50

2.0

2.91

2.74

2.52

2.43

Hardness (Hv)

Wire

56 - 61

59 - 64

61 - 66

63 - 68

FAB

50 - 55

53 - 58

55 - 59

56 - 60

Silver Bonding Wire Applications

Product Series

Recommended Applications

YA1

Common IC packaging such as QFN, TSOP, Flash Memory, TR, IC Cards

YA2

LED packaging, QFP, TSSOP, QFN, DFN, IC Cards, Flash Memory

YA3

Advanced packages, including TQFP, TSSOP, PBGA, and BGA for high-density ICs and memory devices

YA4

High-reliability packaging like TQFP, TSSOP, PBGA, and BGA, especially in power or data systems

Silver Bonding Wire Packing 

Silver Bonding Wire will be carefully placed in wooden cases or cartons, with additional support from soft materials, to prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.

Silver Bonding Wire Packing

Where to Buy Silver Bonding Wire in Bulk?

Heeger Materials Inc., a professional supplier and manufacturer of high-quality Silver products including Silver Bonding Wire, leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.

Heeger Materials Inc. was established in 2016 in Colorado, USA. We are a specialized supplier of premium-grade metals, alloys, ceramics, powders, and other materials catering to research, development, and large-scale industrial production in scientific and industrial sectors. 

Wire Gauge Conversion Chart

Gauge No.

Inch

mm

Gauge No.

Inch

mm

0000

0.4600

11.684

19

0.0359

0.912

000

0.4096

10.404

20

0.0320

0.812

00

0.3648

9.266

21

0.0285

0.724

0

0.3249

8.252

22

0.0253

0.644

1

0.2893

7.348

23

0.0226

0.574

2

0.2576

6.544

24

0.0201

0.511

3

0.2294

5.827

25

0.0179

0.455

4

0.2043

5.189

26

0.0159

0.404

5

0.1819

4.621

27

0.0142

0.361

6

0.1620

4.115

28

0.0126

0.320

7

0.1443

3.665

29

0.0113

0.287

8

0.1285

3.264

30

0.0100

0.255

9

0.1144

2.906

31

0.0089

0.227

10

0.1019

2.588

32

0.0080

0.202

11

0.0907

2.305

33

0.0071

0.180

12

0.0808

2.053

34

0.0063

0.160

13

0.0720

1.828

35

0.0056

0.143

14

0.0641

1.628

36

0.0050

0.127

15

0.0571

1.450

37

0.0045

0.113

16

0.0508

1.291

38

0.0040

0.102

17

0.0453

1.150

39

0.0035

0.089

18

0.0403

1.024

40

0.0031

0.079

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