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Gold/Chromium/Silicon (Au/Cr/Si)...
HM2936
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Gold/Chromium/Silicon (Au/Cr/Si) Epitaxial Wafer features a gold layer with a chromium adhesion layer on a silicon substrate, making it ideal for microelectronics, MEMS, and semiconductor applications. Heeger Materials is a professional supplier and manufacturer of high-quality Au/Cr/Si Wafers, offering customized solutions and competitive prices.
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| Materials | Au/Cr/Si Wafer |
Gold/Chromium/Silicon (Au/Cr/Si) Epitaxial Wafer consists of a gold layer deposited on a chromium adhesion layer over a silicon substrate, ensuring excellent conductivity, adhesion, and surface stability. This structure is widely used in microelectronics, MEMS, optoelectronics, and semiconductor processing, where high-performance metal contacts, reflective coatings, and reliable interconnections are required. The gold layer provides superior electrical properties and corrosion resistance, while the chromium layer enhances adhesion to the silicon base. Heeger Materials provides high-quality Au/Cr/Si Wafers with consistent performance for advanced research and industrial applications.
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Gold/Chromium/Silicon Epitaxial Wafer | Au/Cr/Si Wafer belongs to the epitaxial thin-film wafer range and is selected for controlled substrate and film stack, epitaxial layer composition, thickness, orientation, doping and surface quality. It is commonly used in semiconductor devices, optoelectronics, electronic materials research, heterostructure development and thin-film process studies. When requesting a quote, confirm substrate, layer stack, epitaxial composition, layer thickness, doping or conductivity, orientation, wafer size, surface finish, documentation and quantity.
For material comparison or adjacent product forms, browse wafers and substrates, semiconductor materials, deposition materials and Epitaxial Thin Film.
What epitaxial structure is needed for Gold/Chromium/Silicon Epitaxial Wafer | Au/Cr/Si Wafer? Please provide substrate, layer sequence, composition, thickness, doping or conductivity, orientation, wafer size, surface finish, characterization or documentation needs and quantity.
| Preparation Method | Magnetron Sputtering |
| Conductivity Type | P-type (B-doped), N-type (P-doped) |
| Film Thickness | Au: 40–100nm; Transition layer Cr: 20nm |
| Silicon Wafer Orientation | <100> or <111> |
| Standard Dimensions | Dia2", 10mm×10mm, 10mm×5mm |
Gold/Chromium/Silicon (Au/Cr/Si) Epitaxial Wafer will be securely packaged in sturdy containers with cushioning materials to prevent movement or damage during shipping. This careful packaging ensures that the product arrives in perfect condition, maintaining its high-quality standards throughout the delivery process.

Heeger Materials Inc., a professional supplier and manufacturer of high-quality Epitaxial Thin Film products including Gold/Chromium/Silicon (Au/Cr/Si) Epitaxial Wafer, leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.
Heeger Materials Inc. was established in 2016 in Colorado, USA. We specialize in premium-grade metals, alloys, ceramics, powders, and other materials catering to research, development, and large-scale industrial production in scientific and industrial sectors.
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