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Gold (Au) Bonding Wire, crafted from...
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Gold (Au) Bonding Wire, crafted from gold with a purity of Au≥99.99%, is crucial for forming dependable electrical connections in electronic components. It is frequently used to attach semiconductor chips to circuit boards, guaranteeing durable and consistent performance. HM can customize wire sizes and lengths to meet your individual needs.
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Diameter | 18-75μm |
Materials | Au |
Appearance | Gold |
Purity | 99.99% |
Gold (Au) bonding wire, possessing a purity of Au≥99.99%, is essential for maintaining dependable electrical connections in high-performance electronic devices. It is primarily used in the semiconductor sector to establish reliable connections between semiconductor chips and circuit boards, making it a crucial material for microelectronics and semiconductor packaging. Renowned for its exceptional conductivity, Gold (Au) Bonding Wire ensures effective signal transmission, and its outstanding corrosion resistance provides long-term durability and dependability in challenging conditions. The wire's delicate composition facilitates accurate bonding in complex designs, supporting the miniaturization of modern electronics. HM offers the option to customize the wire’s size, such as diameter and length, to meet specific project requirements, ensuring optimal performance across various applications.
Diameter (μm) | Elongation (%) | Weight per 500 meters (g) | Breaking Load (cN) | ||
G1 | G2 | G3 | |||
18±1 | 2.0-5.0 | 2.457 | >2.5 | >4.0 | >5.0 |
20±1 | 2.0-6.0 | 3.033 | >4.0 | >5.0 | >6.0 |
23±1 | 2.0-7.0 | 4.011 | >5.5 | >7.0 | >8.0 |
25±1 | 2.0-8.0 | 4.739 | >7.5 | >9.0 | >10.0 |
28±1 | 2.0-8.0 | 5.945 | >9.0 | >12.0 | >13.0 |
30±1 | 3.0-8.0 | 6.825 | >11.0 | >13.0 | >15.0 |
32±1 | 3.0-8.0 | 7.765 | >12.0 | >15.0 | >16.0 |
33±1 | 3.0-8.0 | 8.258 | >13.0 | >16.0 | >18.0 |
35±1 | 3.0-10.0 | 9.289 | >15.0 | >18.0 | >20.0 |
38±1 | 3.0-10.0 | 10.950 | >18.0 | >21.0 | >22.0 |
40±1 | 3.0-10.0 | 12.133 | >20.0 | >24.0 | >26.0 |
45±1 | 3.0-12.0 | 15.356 | >25.0 | >28.0 | >30.0 |
50±2 | 3.0-12.0 | 18.958 | >30.0 | >34.0 | >36.0 |
60±3 | 7.0-14.0 | 27.299 | >45.0 | >50.0 | >52.0 |
70±3 | 7.0-14.0 | 37.157 | >55.0 | >60.0 | >63.0 |
75±3 | 7.0-14.0 | 42.655 | >65.0 | >65.0 | >68.0 |
* HM can offer customized services upon specific requests.
The Gold (Au) Bonding Wire will be carefully placed in wooden cases or cartons, with additional support from soft materials, to prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.
Heeger Materials Inc., a professional supplier and manufacturer of high-quality Gold products, including Gold (Au) Bonding Wire leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.
Heeger Materials Inc. was established in 2016 in Colorado, USA. We are a specialized supplier of premium-grade metals, alloys, ceramics, powders, and other materials catering to research, development, and large-scale industrial production in scientific and industrial sectors.
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