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Gold Bonding Wire | Au Bonding Wire

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Gold (Au) Bonding Wire, crafted from gold with a purity of Au≥99.99%, is crucial for forming dependable electrical connections in electronic components. It is frequently used to attach semiconductor chips to circuit boards, guaranteeing durable and consistent performance. HM can customize wire sizes and lengths to meet your individual needs.

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Data sheet

Diameter18-75μm
MaterialsAu
AppearanceGold
Purity99.99%

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Gold (Au) bonding wire, possessing a purity of Au≥99.99%, is essential for maintaining dependable electrical connections in high-performance electronic devices. It is primarily used in the semiconductor sector to establish reliable connections between semiconductor chips and circuit boards, making it a crucial material for microelectronics and semiconductor packaging. Renowned for its exceptional conductivity, Gold (Au) Bonding Wire ensures effective signal transmission, and its outstanding corrosion resistance provides long-term durability and dependability in challenging conditions. The wire's delicate composition facilitates accurate bonding in complex designs, supporting the miniaturization of modern electronics. HM offers the option to customize the wire’s size, such as diameter and length, to meet specific project requirements, ensuring optimal performance across various applications.

Gold Bonding Wire | Au Bonding Wire

Gold (Au) Bonding Wire Specifications

Diameter (μm)

Elongation (%)

Weight per 500 meters (g)

Breaking Load (cN)  

G1

G2

G3

18±1

2.0-5.0

2.457

>2.5

>4.0

>5.0

20±1

2.0-6.0

3.033

>4.0

>5.0

>6.0

23±1

2.0-7.0

4.011

>5.5

>7.0

>8.0

25±1

2.0-8.0

4.739

>7.5

>9.0

>10.0

28±1

2.0-8.0

5.945

>9.0

>12.0

>13.0

30±1

3.0-8.0

6.825

>11.0

>13.0

>15.0

32±1

3.0-8.0

7.765

>12.0

>15.0

>16.0

33±1

3.0-8.0

8.258

>13.0

>16.0

>18.0

35±1

3.0-10.0

9.289

>15.0

>18.0

>20.0

38±1

3.0-10.0

10.950

>18.0

>21.0

>22.0

40±1

3.0-10.0

12.133

>20.0

>24.0

>26.0

45±1

3.0-12.0

15.356

>25.0

>28.0

>30.0

50±2

3.0-12.0

18.958

>30.0

>34.0

>36.0

60±3

7.0-14.0

27.299

>45.0

>50.0

>52.0

70±3

7.0-14.0

37.157

>55.0

>60.0

>63.0

75±3

7.0-14.0

42.655

>65.0

>65.0

>68.0

* HM can offer customized services upon specific requests.

Gold (Au) Bonding Wire Applications

  • Semiconductor Packaging: Crucial for linking semiconductor chips to circuit boards, ensuring stable and dependable connections in microelectronics and integrated circuits.
  • Microelectronics: Commonly used in creating advanced microelectronic parts, where superior conductivity and minimal wire dimensions are essential for peak performance and reliability.
  • LED Lighting: Employed in the production of LEDs to establish strong, conductive connections, enhancing durability and efficiency in lighting applications.
  • Medical Devices: Applied in healthcare tools, where its corrosion resistance and biocompatibility ensure safe and enduring connections for sensitive instruments.
  • Aerospace & Defense: Applied in aerospace and military electronics to secure delicate components in highly reliable environments, where longevity and performance are critical.

Gold (Au) Bonding Wire Packing 

The Gold (Au) Bonding Wire will be carefully placed in wooden cases or cartons, with additional support from soft materials, to prevent shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.

Gold Bonding Wire | Au Bonding Wire Packing

Where to Buy Gold (Au) Bonding Wire in Bulk?

Heeger Materials Inc., a professional supplier and manufacturer of high-quality Gold products, including Gold (Au) Bonding Wire leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.

Heeger Materials Inc. was established in 2016 in Colorado, USA. We are a specialized supplier of premium-grade metals, alloys, ceramics, powders, and other materials catering to research, development, and large-scale industrial production in scientific and industrial sectors. 

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