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New Gold-Silicon Alloy Preformed Solder Sheet, Au96.85Si3.15-Heeger Materials Inc View larger

Gold-Silicon Alloy Preformed Solder Sheet, Au96.85Si3.15

HM3061

New product

Gold-Silicon Alloy Preformed Solder Sheet offers high reliability and excellent mechanical strength, particularly in high-performance applications such as semiconductor packaging and optoelectronic devices. Heeger Materials provides high-quality Gold-Silicon Alloy Preformed Solder Sheet, offering customized solutions and competitive prices.

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Data sheet

Thickcustomized
MaterialsAu96.85Si3.15

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Gold-Silicon Alloy Preformed Solder Sheet is a high-performance soldering material composed of 96.85% gold and 3.15% silicon. This alloy provides outstanding mechanical strength, excellent thermal conductivity, and electrical performance, making it ideal for semiconductor packaging and optoelectronic device assembly. The preformed solder sheets ensure precise and reliable bonding, with a relatively low melting point, facilitating smooth and efficient soldering processes. This material is particularly useful in applications where high reliability, resistance to thermal fatigue, and superior bonding integrity are critical. Heeger Materials provides customizable solutions for various electronic assembly needs, ensuring high-quality performance in advanced applications.
Gold-Silicon Alloy Preformed Solder Sheet, Au96.85Si3.15

Gold-Silicon Alloy Preformed Solder Sheet Advantages

  • High Mechanical Strength: Provides strong bonding with superior mechanical strength, ensuring long-lasting performance in demanding applications.
  • Excellent Thermal Conductivity: Offers excellent thermal conductivity, making it ideal for heat-sensitive devices.
  • Low Melting Point: The relatively low melting point ensures smooth and efficient soldering without compromising the integrity of sensitive components.
  • Reliable Electrical Performance: Ensures high electrical conductivity, making it perfect for semiconductor and optoelectronic device applications.
  • Resistance to Thermal Fatigue: Excellent resistance to thermal cycling, ensuring durability and reliability in high-temperature environments.

Gold-Silicon Alloy Preformed Solder Sheet Applications

  • Semiconductor Packaging: Used for precise bonding in semiconductor device packaging, ensuring reliable connections.
  • Optoelectronic Device Assembly: Ideal for assembling optoelectronic devices, providing strong and stable bonds.
  • Microelectronics Soldering: Applied in microelectronics for high-performance solder joints with excellent thermal and electrical conductivity.
  • High-Temperature Electronics: Suitable for high-temperature applications that require robust, long-lasting solder connections.
  • Aerospace Electronics: Used in aerospace electronics for reliable, high-strength solder joints that endure extreme conditions.

Gold-Silicon Alloy Preformed Solder Sheet Packing 

The Gold-Silicon Alloy Preformed Solder Sheet will be packaged according to the size and shape selected by the customer. The main packaging methods we offer include VR boxes, bottled packaging, reels, blue film, and taping. Each method is designed to ensure the safe transport of the product and avoid any damage during transit, guaranteeing its integrity and optimal condition upon arrival.

Gold-Silicon Alloy Preformed Solder Sheet Packing

Where to Buy Gold-Silicon Alloy Preformed Solder Sheet in Bulk?

Heeger Materials Inc., a professional supplier and manufacturer of high-quality Gold products, including Gold-Silicon Alloy Preformed Solder Sheet, leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.

Heeger Materials Inc. was established in 2016 in Colorado, USA. We are a specialized supplier of premium-grade metals, alloys, ceramics, powders, and other materials catering to research, development, and large-scale industrial production in scientific and industrial sectors. 

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