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Gold Sputtering Target can be used in...
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Gold Sputtering Target can be used in semiconductor, chemical vapor deposition (CVD), physical vapor deposition (PVD) display, and optical applications. We are a supplier of high-quality Gold Sputtering Target at competitive prices.
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| Shape | Disc/Rectangular/Tube |
| Bonding | Unbonding/Bonding |
| Symbol | Au |
| Purity | 99.99% |
HM provides high-quality Gold Sputtering targets for research and industry purposes at competitive prices. We can provide Gold Sputtering Target with different purity, size, and density according to your requirements.

Gold (Au) Sputtering Target belongs to the Sputtering Targets range and is selected for controlled material quality, application-specific specifications and reliable supply for research or production use. It is commonly used in thin-film deposition, sputtering, coating development and semiconductor or optical research as well as research, development, specialty manufacturing, laboratory use and industrial material projects. When requesting a quote, confirm purity, diameter or plate size, thickness, density, bonding requirement and backing plate details.
For material comparison or adjacent product forms, browse all products, deposition materials, technical ceramics and Sputtering Targets.
What sputtering target specifications are needed? Please provide purity, diameter or plate size, thickness, density, bonding requirement, backing plate material and deposition system.
Circular Sputtering Targets | Diameter | 1.0” 2.0” 3.0” 4.0” 5.0” 6.0” up to 21” |
Rectangular Sputtering Targets | Width x Length | 5” x 12” 5” x 15” 5” x 20” 5” x 22” 6” x 20” |
Thickness | 0.125”, 0.25” | |
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Symbol | Au |
Atomic Weight | 196.97 |
Atomic Number | 79 |
Color/Appearance | Gold, metallic |
Thermal Conductivity | 320 W/m·K |
Melting Point (℃) | 1064 |
Coefficient of Thermal Expansion | 14.2×10-6/K |
Theoretical Density (g/cc) | 19.32 |
Z Ratio | 0.381 |
Sputter | DC |
Max Power Density (Watts/Square Inch) | 100* |
Type of Bond | Indium, Elastomer |
Gold Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
The Lead time of the Gold Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.
Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.
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