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Boron (B) Sputtering Target

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Boron Sputtering Target can be used in semiconductors, chemical vapor deposition (CVD), physical vapor deposition (PVD) display, and optical applications. We are a supplier of high-quality Boron Sputtering Target at competitive prices.

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$488.00

  • 99.9%




Data sheet

ShapeDisc/Rectangular/Tube
BondingUnbonding/Bonding
SymbolB
Purity99.5%

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Boron (B) Sputtering Targets are frequently utilized in thin-film deposition techniques, where boron is applied to substrates to form high-quality, long-lasting films. These targets are vital for a range of applications, such as semiconductor production, optical coatings, and durable coatings. Boron films offer outstanding characteristics, including remarkable wear resistance, corrosion resistance, and good electrical conductivity. In the semiconductor sector, boron is frequently utilized for doping during the production of electronic devices. Moreover, boron coatings are utilized in cutting tools, aerospace parts, and protective layers because of their toughness and longevity. Boron sputtering targets can be found in both pure and alloyed varieties for custom applications.HM provides high-quality Boron Sputtering Target for research and industry purposes at competitive prices. We can provide Boron Sputtering Target with different purity, size, and density according to your requirements.

  • High purity and density
  • Low particle
  • Uniform film thickness distribution
  • High efficiency in the use

Boron (B) Sputtering Target Specifications

Material Type

Boron

Symbol

B

Atomic Weight

10.811

Atomic Number

5

Color/Appearance

Black, Semi-metallic

Thermal Conductivity

27 W/m.K

Melting Point (°C)

2,079

Coefficient of Thermal Expansion

6 x 10-6/K

Theoretical Density (g/cc)

2.34

Z Ratio

0.389

Sputter

RF

Max Power Density (Watts/Square Inch)

20*

Type of Bond

Indium

Boron (B) Sputtering Target Dimensions

Circular Sputtering Targets

Diameter

1.0”

2.0”

3.0”

4.0”

5.0”

6.0”

up to 21”

Rectangular Sputtering Targets

Width x Length

5” x 12”

5” x 15”

5” x 20”

5” x 22”

6” x 20”

Thickness

0.125”, 0.25”

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Boron (B) Sputtering Target Applications

  • Semiconductor Production: Boron sputtering targets are utilized to dope semiconductors, incorporating boron to alter the electrical characteristics of silicon wafers.
  • Thin Film Coatings: Boron sputtering targets are used to produce thin films for electronics, optics, and solar cells. These films enhance hardness, abrasion resistance, and optical characteristics.
  • Magnetic Materials: Boron sputtering targets serve to create magnetic materials such as hard drives and sensors. Boron enhances their magnetic characteristics.
  • Solar Cells: Boron enhances the efficiency of thin-film solar cells. Boron sputtering targets are utilized to produce boron-doped films that enhance the efficiency of solar energy conversion.
  • Plasma Display Panels (PDPs): Boron sputtering targets are utilized in plasma display panels to enhance display quality and energy efficiency.

Boron (B) Sputtering Target Delivery and Packaging

The Lead time of the Boron Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.

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