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Boron Sputtering Target can be used...
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Boron Sputtering Target can be used in semiconductors, chemical vapor deposition (CVD), physical vapor deposition (PVD) display, and optical applications. We are a supplier of high-quality Boron Sputtering Target at competitive prices.
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Shape | Disc/Rectangular/Tube |
Bonding | Unbonding/Bonding |
Symbol | B |
Purity | 99.5% |
Boron (B) Sputtering Targets are frequently utilized in thin-film deposition techniques, where boron is applied to substrates to form high-quality, long-lasting films. These targets are vital for a range of applications, such as semiconductor production, optical coatings, and durable coatings. Boron films offer outstanding characteristics, including remarkable wear resistance, corrosion resistance, and good electrical conductivity. In the semiconductor sector, boron is frequently utilized for doping during the production of electronic devices. Moreover, boron coatings are utilized in cutting tools, aerospace parts, and protective layers because of their toughness and longevity. Boron sputtering targets can be found in both pure and alloyed varieties for custom applications.HM provides high-quality Boron Sputtering Target for research and industry purposes at competitive prices. We can provide Boron Sputtering Target with different purity, size, and density according to your requirements.
Material Type | Boron |
Symbol | B |
Atomic Weight | 10.811 |
Atomic Number | 5 |
Color/Appearance | Black, Semi-metallic |
Thermal Conductivity | 27 W/m.K |
Melting Point (°C) | 2,079 |
Coefficient of Thermal Expansion | 6 x 10-6/K |
Theoretical Density (g/cc) | 2.34 |
Z Ratio | 0.389 |
Sputter | RF |
Max Power Density (Watts/Square Inch) | 20* |
Type of Bond | Indium |
Circular Sputtering Targets | Diameter | 1.0” 2.0” 3.0” 4.0” 5.0” 6.0” up to 21” |
Rectangular Sputtering Targets | Width x Length | 5” x 12” 5” x 15” 5” x 20” 5” x 22” 6” x 20” |
Thickness | 0.125”, 0.25” |
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
The Lead time of the Boron Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.
Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.
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