Boron Nitride (BN) Sputtering Target

HM provides high-quality Boron Nitride Sputtering Target for research and industry purposes at competitive prices. We can provide Boron Nitride Sputtering Target with different purities, sizes, and densities according to your requirements.

• High purity and density
• Low particle
• Uniform film thickness distribution
• High efficiency in the use

Boron Nitride Sputtering Target Dimensions

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Boron Nitride Sputtering Target Applications

• Thin-Film Coatings: Used to deposit BN films for electronic devices, optical components, and protective layers.
• Semiconductor Manufacturing: Applied in dielectric layers, insulating coatings, and high-performance microelectronic components.
• Aerospace and Defense: Produces lightweight, heat-resistant coatings for advanced structural and thermal management applications.
• Tribological Coatings: Form low-friction, wear-resistant surfaces for mechanical parts and cutting tools.
• High-Temperature Equipment: Used to create stable coatings that withstand extreme heat in furnaces, reactors, and thermal systems.

Boron Nitride Sputtering Target Delivery and Packaging

The Lead time of the Boron Nitride Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.