What are Sputtering Targets？
“Target” in “sputtering target” is derived from the shooting target, which is very common in our lives. In the process of PVD, the coating material is bombarded by an electron beam or ion beam, just like the target being shot, so much material got its name as “target”. That's why they call this material a "sputtering target." After knowing where the name came from, you may think “sputtering target” is not weird anymore.
Heeger Materials Inc., is a professional supplier and manufacturer of high-quality Sputtering Targets including high-quality Tantalum (Ta) Sputtering Target, Antimony (Sb) Sputtering Target, ITO Sputtering Target, Gadolinium (Gd) Sputtering Target, Chromium (Cr) Sputtering Targets etc., leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction. You can safely choose to buy Sputtering Targets from Heeger Materials Inc..
Different Types of Sputtering Targets
The sputtering target is a broad concept, including many categories such as metal sputtering target, alloy sputtering target, ceramic sputtering target, and so on. Practically any material alloy, mixture, pure metal, oxide, nitride, boride, or carbide can be supplied as a sputter target.
Sputtering target types:
- Metal targets
- Pure metal targets: Made of a single metal, such as aluminum (Al), copper (Cu), nickel (Ni), etc.
- Alloy targets: Made of two or more metals, such as titanium aluminum alloy (TiAl), copper aluminum alloy (CuAl), etc.
- Oxide targets
- Oxides: Including aluminum oxide (Al2O3), titanium dioxide (TiO2), etc.
- Nitrides: For example, aluminum nitride (AlN), silicon nitride (Si3N4), etc.
- Carbide targets
- Silicon carbide (SiC): Used to prepare high-temperature resistant materials.
- Tungsten carbide (WC): Used to prepare wear-resistant materials.
- Boride targets
- Silicon boride (BSi): Used to prepare semiconductor materials.
- Magnetic material targets
- Iron (Fe): Used for magnetic recording media and sensors.
- Nickel iron (NiFe): Used for magnetic storage devices.
- Semiconductor material targets
- Silicon (Si): Used in integrated circuit manufacturing.
- Germanium (Ge): Used in infrared optical devices.
Applications of Sputtering Targets
Sputtering targets are mainly used in flat panel displays, optical components, energy-saving glass, semiconductors, solar cells, and other industries; used for the preparation of magnetic materials; used for decorative coatings, such as the preparation of metal films on ceramics, glass, and metal products; used for the preparation of protective coatings, such as on glasses, masks, car windows, and other products; used for the preparation of conductive films, such as in touch screens, flexible electronic devices and other applications.
Manufacturing Process of Sputtering Target Materials
Heeger Materials Inc. combines different technologies to produce sputtering target materials. The Sputtering target is a material used in the physical vapor deposition (PVD) process to coat thin films on various surfaces. In this section, we combine melting, sintering, synthesis, and machining technologies to produce sputtering target products of different materials, purity, and shapes. The choice of manufacturing process depends on the material characteristics and the final application. Various types of sputtering target materials can also be produced using these manufacturing processes: conventional and vacuum hot pressing, cold pressing and sintering, as well as vacuum melting and casting.
State-of-the-art powder mixing and/or alloying through sintering and/or melting of raw materials and subsequent grinding allow us to meet the highest quality standards. Each production lot of material is sent through various analytical processes, and a certificate of analysis is provided with each shipment.
Grain structure is a key factor in a sputtering target’s process performance. Finer grain sizes reduce variation in film uniformity and deposition rates. Random, or equiaxed, grain orientation also improves film uniformity. Properly controlling the grain structure of the target enables higher-yielding, more consistent deposition processes.
We use a variety of advanced manufacturing methods to produce sputter targets with an excellent grain structure and from our broad portfolio of sputtering target materials in nearly any shape or size. Please contact us if your required sputtering target material or purity is not listed.
Where to buy Sputtering Target in Bulk
Heeger Materials Inc., a professional supplier and manufacturer of high-quality Sputtering Target Materials, leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction. You can safely choose to buy Sputtering Target from Heeger Materials Inc.