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Tantalum (Ta) Sputtering Target

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Tantalum Sputtering Targets can be used in semiconductors, chemical vapor deposition (CVD), physical vapor deposition (PVD) display, and optical applications. Heeger Materials is a professional supplier and manufacturer of high-quality Tantalum Sputtering Target, offering competitive prices and customized solutions to meet specific requirements.

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Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

$147.00

  • 99.9%




Data sheet

ShapeDisc/Rectangular/Tube
BondingUnbonding/Bonding
SymbolTa
Purity99.9%

More info

Tantalum, a transition metal and refractory metal known for its corrosion resistance, has a melting point of 3,017°C, a density of 16.6 g/cc, and a vapor pressure of 10-4 Torr at 2,590°C. It is metallic gray-blue and shares many chemical properties with niobium. Tantalum is used in surgical implants due to its non-toxic nature, as well as in capacitors for electronics. It can be alloyed to enhance strength and durability and is used in vacuum evaporation to create semiconductors, optical coatings, magnetic storage media, and wear- and corrosion-resistant coatings.

HM provides high-quality Tantalum Sputtering Target for research and industry purposes at competitive prices. We can provide a Tantalum Sputtering Target with different purity, size, and density per your requirements.

Tantalum (Ta) Sputtering Target

  • High purity and density
  • Low particle
  • Uniform film thickness distribution
  • High efficiency in the use

Tantalum (Ta) Specifications

Material Type

Tantalum

Coefficient of Thermal Expansion

6.3 x 10-6/K

Symbol

Ta

Theoretical Density (g/cc)

16.6

Atomic Weight

180.94788

Z Ratio

0.262

Atomic Number

73

Sputter

DC

Color/Appearance

Gray Blue, Metallic

Max Power Density (Watts/Square Inch)

50*

Thermal Conductivity

57 W/m.K

Type of Bond

Indium, Elastomer

Melting Point (°C)

3,017

Comments

Forms good films.

Tantalum Sputtering Target Dimensions

Circular Sputtering Targets

Diameter

1.0”

2.0”

3.0”

4.0”

5.0”

6.0”

up to 21”

Rectangular Sputtering Targets

Width x Length

5” x 12”

5” x 15”

5” x 20”

5” x 22”

6” x 20”

Thickness

0.125”, 0.25”

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Tantalum Sputtering Target Applications

Tantalum Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Tantalum Sputtering Target Delivery and Packaging

The Lead time of the Tantalum Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials Inc., a professional supplier and manufacturer of high-quality tantalum products, leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.

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