High-Purity Tantalum (Ta) Sputtering Target

Tantalum Sputtering Target Specifications

Final specifications should be confirmed according to target geometry, deposition system, bonding method, backing plate, and application requirements.

Key Features

• High-purity tantalum
• High-density target material
• Controlled grain structure
• Low impurity levels
• Consistent target quality
• Circular, rectangular, and rotary targets
• Bonded and unbonded configurations
• Custom target dimensions
• Custom backing plates
• Custom surface and grain-size requirements
• Drawing-based manufacturing

Standard Tantalum Target Dimensions

Circular Tantalum Targets

Standard circular target diameters include:

1" / 2" / 3" / 4" / 5" / 6" and custom diameters up to 21"

Standard thicknesses include:

0.125" and 0.25"

Custom diameter and thickness combinations are available upon request.

Rectangular Tantalum Targets

Standard rectangular sizes include:

• 5" × 12"
• 5" × 15"
• 5" × 20"
• 5" × 22"
• 6" × 20"

Custom width, length, thickness, tolerances, and backing configurations can be reviewed according to your sputtering system.

Bonded Tantalum Sputtering Targets

Tantalum sputtering targets can be supplied bonded to a backing plate or as unbonded target material.

Bonding requirements depend on target geometry, sputtering system, power conditions, thermal management, and backing plate design.

Available bonding options include:

• Indium bonding
• Elastomer bonding
• Customer-specified bonding configurations

When requesting a bonded target, please provide the target dimensions, backing plate material and dimensions, bonding method, and sputtering-system information.

Custom Tantalum Sputtering Targets

Heeger Materials supplies custom tantalum sputtering targets according to customer drawings and deposition-system requirements.

Custom specifications can include:

• Purity
• Target shape
• Diameter
• Width and length
• Thickness
• Dimensional tolerances
• Density
• Grain size
• Grain-size uniformity
• Surface roughness
• Flatness
• Impurity limits
• N/O/C/S requirements
• Bonding
• Backing plate material
• Custom target geometry

Send us your drawing or existing target specification for manufacturability review and quotation.

Tantalum Sputtering Target Applications

Semiconductor Manufacturing

Tantalum sputtering targets are used in semiconductor thin-film deposition processes where controlled material purity, film uniformity, and reliable target performance are required.

PVD Thin-Film Deposition

Tantalum targets are suitable for physical vapor deposition and magnetron sputtering processes used to deposit tantalum thin films onto selected substrates.

Display and Electronic Coatings

Tantalum sputtering targets can be used in electronic and display-related thin-film processes requiring tantalum-based coatings.

Optical Coatings

Tantalum target materials are also used in thin-film research and optical coating processes.

Research & Development

Standard and custom tantalum targets are available for universities, laboratories, coating development, prototype deposition, and materials research.

How to Specify a Tantalum Sputtering Target

For an accurate quotation, please provide:

Purity: Required tantalum purity
Shape: Circular, rectangular, rotary, or custom
Dimensions: Diameter × thickness or width × length × thickness
Density: Required density specification, if applicable
Grain Size: Required grain-size specification
Surface Finish: If specified
Bonding: Bonded or unbonded
Backing Plate: Material and dimensions
Sputtering System: Equipment/model if relevant
Quantity: Required number of targets
Drawing: Recommended for custom or bonded targets

Quality Requirements

Depending on the application, tantalum sputtering targets can be supplied according to customer-specific requirements for:

• Chemical purity
• Density
• Grain size
• Grain-size uniformity
• Flatness
• Surface roughness
• Impurity content
• N/O/C/S levels
• Dimensional tolerances
• Bond integrity

Please include any critical target specifications with your inquiry.

Delivery & Packaging

Typical lead time for tantalum sputtering targets is 2–5 weeks, subject to target size, purity, bonding requirements, and quantity.

Targets are carefully packaged to protect the surface and geometry during transportation. Technical documentation such as COA and SDS/MSDS can be supplied with the product as applicable.

Tantalum Sputtering Target FAQ

What purity of tantalum sputtering target is available?

Heeger Materials supplies 99.9% tantalum sputtering targets, with higher-purity specifications available upon request. Please specify the required purity and impurity limits when requesting a quotation.

What tantalum sputtering target sizes are available?

Standard circular targets are available from 1" to 6" diameter, with custom diameters up to 21". Standard rectangular sizes and custom dimensions are also available.

Can you manufacture custom tantalum sputtering targets?

Yes. Custom target shape, dimensions, thickness, tolerance, density, grain size, surface finish, bonding, and backing plate configurations can be reviewed according to customer drawings.

Can tantalum sputtering targets be bonded to backing plates?

Yes. Bonded and unbonded tantalum targets are available. Indium and elastomer bonding options are offered, with custom backing plate configurations available upon request.

What information is required for a tantalum target quotation?

Please provide the required purity, target shape, dimensions, density and grain-size requirements, surface finish, bonding method, backing plate details, quantity, and drawing if available.

What is the typical lead time?

Typical lead time is 2–5 weeks, depending on target dimensions, purity, bonding requirements, quantity, and other custom specifications.