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Metalized Aluminum Nitride Substrate | AlN Substrate
HM2951
New product
Metalized Aluminum Nitride (AlN) Substrate combines high thermal conductivity, electrical insulation and metallized surfaces for power electronics, RF devices, LED modules and semiconductor packaging. Custom size, thickness and metallization options are available.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Data sheet
| Materials | Metallized AlN Substrate |
More info
Metalized Aluminum Nitride (AlN) Substrate is a high-performance ceramic material known for its exceptional thermal conductivity, electrical insulation, and mechanical stability. It is widely used in power electronics, RF devices, and semiconductor packaging, where efficient heat dissipation and electrical reliability are critical. The metalized surface allows for secure bonding and improved electrical connections, making it suitable for applications such as LED modules, high-frequency circuits, and power semiconductor devices. In addition to Metalized Aluminum Nitride Substrate, we also offer AlN Ceramic Substrate and AlN Single Crystal Substrate to meet various application needs. Heeger Materials provides high-quality Metalized Aluminum Nitride Substrate with customizable specifications to meet diverse industry requirements.
Metalized Aluminum Nitride Substrate | AlN Substrate Selection Notes
Metalized Aluminum Nitride Substrate | AlN Substrate belongs to the ceramic substrate range and is selected for controlled ceramic composition, dimensions, thickness, flatness, thermal performance and metallization pattern or adhesion. It is commonly used in power electronics, thermal management, circuits, semiconductor packaging, sensors and high-reliability electronic assemblies. When requesting a quote, confirm ceramic material and grade, dimensions, thickness, flatness, surface finish, metallization material and pattern, adhesion or plating requirement, drawing, quantity and packaging.
AlN substrates are specified by thermal performance, substrate size, thickness and metallization stack. Explore more Ceramic Substrates, Wafers & Substrates and the materials blog.
Customization options: Specify size, thickness, flatness, metallization material, pattern, bonding requirement, surface finish, drawing, cleaning and quantity.
Related Materials and Product Forms
For material comparison or adjacent product forms, browse technical ceramics, wafers and substrates, alumina ceramics and Ceramic Substrates.
Related ceramic options include Yttria Stabilized Zirconia Disc and Zirconia Ceramic Plate.
FAQ
What metallization details are needed for Metalized Aluminum Nitride Substrate | AlN Substrate? Please provide ceramic grade, dimensions, thickness, flatness, metallization material and pattern, adhesion or plating requirements, drawing, quantity, packaging and intended electronic assembly.
What metallization details should be provided?
Please include metallization material, thickness, pattern, bonding method, drawing and any solderability or adhesion requirements.
Can AlN substrates be customized?
Yes. Custom dimensions, thicknesses, metallization and surface processing can be reviewed against the application requirements.
Metalized Aluminum Nitride Substrate Stock Specifications
Model | Material Type | Bulk Resistivity | Sheet Resistance | Adhesion | Solderability | Maximum Size | Remarks |
SD5121 | Thick Film Pd-Ag | 20 | >1.5 | Excellent | Excellent | 50×50 mm² | - |
SD5122 | Thick Film W or Mo | 25 | >1.5 | Excellent | Excellent | 50×50 mm² | Post-plated with Ni |
SD5131 | Thin Film Ti/Cu/Ni/Au | <5 | >2.5 | Excellent | Excellent | 50×50 mm² | Suitable for power electronic devices |
SD5132 | Thin Film Ta₂N/Ni | <5 | >2.5 | Excellent | Excellent | 50×50 mm² | Suitable for microwave devices |
SD5140 | Direct Cu Bonding | <0.1 | 2.5 | Excellent | Excellent | 50×50 mm² | Also known as DBC |
| Material | Aluminum nitride ceramic with metallized surface |
|---|---|
| CAS | 24304-00-5 for aluminum nitride material |
| Purity or grade | AlN ceramic grade and metallization stack by request |
| Form | Substrate, plate or custom metallized ceramic component |
| Packaging | Clean, protected packaging for substrate surfaces and metallization |
Metalized Aluminum Nitride Substrate Applications
- Power Electronics: Used in high-power semiconductor modules, IGBT substrates, and power amplifiers for efficient heat dissipation.
- RF and Microwave Devices: Provides excellent thermal and electrical performance for RF power transistors, microwave circuits, and antennas.
- LED Packaging: Enhances thermal management and reliability in high-power LED applications.
- Aerospace and Defense: Utilized in radar systems, satellite communication, and military-grade electronics requiring high thermal stability.
- Automotive Electronics: Supports advanced driver-assistance systems (ADAS), electric vehicle power modules, and other high-performance automotive components.
- Power electronics and semiconductor packaging
- RF, microwave and high-frequency circuit substrates
- LED modules and heat-dissipating electronic assemblies
Metalized Aluminum Nitride Substrate Packing And Shipping
Metalized Aluminum Nitride (AlN) Substrate will be securely packaged in sturdy containers with cushioning materials to prevent movement or damage during shipping. This careful packaging ensures that the product arrives in perfect condition, maintaining its high-quality standards throughout the delivery process.
Where to Buy Metalized Aluminum Nitride Substrate in Bulk?
Heeger Materials Inc., a professional supplier and manufacturer of high-quality Ceramic Substrate products including Metalized Aluminum Nitride (AlN) Substrate, leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.
Heeger Materials Inc. was established in 2016 in Colorado, USA. We specialize in premium-grade metals, alloys, ceramics, powders, and other materials catering to research, development, and large-scale industrial production in scientific and industrial sectors.
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