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Aluminum Nitride (AlN) Products
Laser Cutting Aluminum Nitride (AlN) Ceramic Substrate
New product
Aluminum Nitride (AlN) Ceramic possesses excellent thermal conductivity and insulation properties. Heeger Materials can provide top-quality and various types of aluminum nitride ceramic products and offer customization services based on customer drawings, allowing for any desired specifications and shapes. Our capabilities include cutting, drilling, milling, laser scribing, and laser marking.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Data sheet
| Shape | Per request or drawing |
| Materials | AlN |
| Size | Per request or drawing |
| Production Method | Laser Cutting |
More info
Aluminum Nitride (AlN) Ceramic is a new type of functional electronic ceramic material, which is produced by using aluminum nitride powder as raw material and employing a tape casting process followed by high-temperature sintering. It has excellent thermal conductivity, low dielectric constant, and dielectric loss.
HM can use laser processing to meet the customer's specific requirements according to drawings, including processes such as marking, punching, and slotting. Laser punching can achieve a minimum hole diameter of 0.05mm, and laser cutting can handle thicknesses below 2mm. Advanced processing technology ensures high precision and good repeatability.
Aluminum Nitride (AlN) Ceramic Properties
Item | Unit | Test Standard |
Density | g/cm3 | ≥3.30 |
Melting Point | ℃ | 2500 |
Thermal Conductivity | 25℃ W/(m.k) | ≥170 |
Dielectric Constant | 1 MHz, 25℃ | 9 |
Dielectric Loss | 1 MHz, 25℃ | 4.6×10-4 |
Dielectric Strength | Kv/mm | ≥15 |
Flexural Strength | Mpa | ≥350 |
Elastic Modulus | GPa | 310-320 |
Warpage | ~/25(length) | 0.002-0.005 |
Surface roughness | um |
|
Coefficient of thermal expansion | 20～300℃ (10-6/℃) | 4.6 |
Volume resistivity | 20℃.Ω.cm | 1.5×1014 |
Water Absorption | % | 0 |
Aluminum Nitride (AlN) Ceramic Laser Processing
- Cutting
- Drilling
- Milling
- Laser scribing
- Laser Marking
Laser Cutting Aluminum Nitride (AlN) Ceramic Substrate Applications
- Used in electronic devices such as substrates for high-power integrated circuits, heat sinks, and insulating components due to their excellent thermal conductivity and electrical insulation properties.
- Used for the manufacturing of components used in optoelectronic devices, including LED packages, laser diode mounts, and optical components.
Laser Cutting Aluminum Nitride (AlN) Ceramic Substrate Packing
Laser Cutting Aluminum Nitride (AlN) Ceramic Substrate is carefully packaged with adhesive-free surface protection tape and cardboard boxes to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
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