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Aluminum Nitride (AlN) Ceramic Structural Components
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Aluminum Nitride (AlN) Ceramic Structural Components have excellent thermal conductivity, low dielectric constant, and dielectric loss, which are widely used in the electronics industry. Heeger Materials can provide the best Aluminum Nitride (AlN) Ceramic Structural Components at a competitive price. We can offer customized solutions according to specific requirements.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Data sheet
| Materials | AlN |
| Size | Customized |
More info
Aluminum Nitride (AlN) Ceramic Structural Components have reliable insulating properties, excellent mechanical properties, non-toxic, high-temperature resistance, chemical resistance, and good resistance to plasma etching. The production process mainly adopts the dry press molding method. Aluminum Nitride (AlN) ceramics have a thermal conductivity of 170W / (mk), which is 5-8 times that of alumina ceramics. Therefore, AlN ceramics have good thermal shock resistance and can be used in a high-temperature environment of 2200 ℃.
Aluminum Nitride (AlN) Ceramic Structural Components Properties
Item | Unit | Test Standard |
Density | g/cm3 | ≥3.30 |
Melting Point | ℃ | 2500 |
Thermal Conductivity | 25℃ W/(m.k) | ≥170 |
Dielectric Constant | 1 MHz, 25℃ | 9 |
Dielectric Loss | 1 MHz, 25℃ | 4.6×10-4 |
Dielectric Strength | Kv/mm | ≥15 |
Flexural Strength | Mpa | ≥350 |
Elastic Modulus | GPa | 310-320 |
Warpage | ~/25(length) | 0.002-0.005 |
Surface roughness | um |
|
Coefficient of thermal expansion | 20～300℃ (10-6/℃) | 4.6 |
Volume resistivity | 20℃.Ω.cm | 1.5×1014 |
Water Absorption | % | 0 |
Customized Solutions
HM can offer customized services, and specific shapes and sizes can be processed according to drawings.
Aluminum Nitride (AlN) Ceramic Structural Components Applications
- Radiators and heat sinks
- Laser electrical insulators
- Chucks, clamping rings for semiconductor processing equipment
- Silicon wafer processing
- Substrates and insulators for microelectronic and optoelectronic equipment
- Electronic packaging substrates
- Chip carriers for sensors and detectors
Aluminum Nitride (AlN) Ceramic Structural Components Packing
Aluminum Nitride (AlN) Ceramic Structural Components are carefully packaged with adhesive-free surface protection tape and cardboard boxes to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
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