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Aluminum Nitride (AlN) Ceramic Structural Components
New product
Aluminum Nitride (AlN) Ceramic Structural Components exhibit exceptional thermal conductivity, low dielectric constant, and minimal dielectric loss, making them extensively utilized in the electronics industry. Heeger Materials can provide top-quality Aluminum Nitride (AlN) Ceramic Structural Components at a competitive price, with customized services to meet specific requirements.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Data sheet
| Materials | AlN |
| Size | Customized |
More info
Aluminum Nitride (AlN) Ceramic Structural Components offer dependable insulation, outstanding mechanical properties, non-toxicity, high-temperature resistance, chemical resistance, and excellent resistance to plasma etching. The primary production method involves dry press molding. With a thermal conductivity of 170W / (mk), Aluminum Nitride (AlN) ceramics surpass alumina ceramics by 5-8 times. Consequently, AlN ceramics exhibit impressive thermal shock resistance, enabling their application in environments reaching temperatures up to 2200 ℃.
Aluminum Nitride (AlN) Ceramic Structural Components Properties
Item | Unit | Test Standard |
Density | g/cm3 | ≥3.30 |
Melting Point | ℃ | 2500 |
Thermal Conductivity | 25℃ W/(m.k) | ≥170 |
Dielectric Constant | 1 MHz, 25℃ | 9 |
Dielectric Loss | 1 MHz, 25℃ | 4.6×10-4 |
Dielectric Strength | Kv/mm | ≥15 |
Flexural Strength | Mpa | ≥350 |
Elastic Modulus | GPa | 310-320 |
Warpage | ~/25(length) | 0.002-0.005 |
Surface roughness | um | 1.8 |
Coefficient of thermal expansion | 20～300℃ (10-6/℃) | 4.6 |
Volume resistivity | 20℃.Ω.cm | 1.5×1014 |
Water Absorption | % | 0 |
Customized Solutions
HM provides customized services, processing specific shapes and sizes according to drawings.
Aluminum Nitride (AlN) Ceramic Structural Components Applications
- Radiators and heat sinks
- Laser electrical insulators
- Chucks, clamping rings for semiconductor processing equipment
- Silicon wafer processing
- Substrates and insulators for microelectronic and optoelectronic equipment
- Electronic packaging substrates
- Chip carriers for sensors and detectors
Aluminum Nitride (AlN) Ceramic Structural Components Packing
Aluminum Nitride (AlN) Ceramic Structural Components are carefully packaged with adhesive-free surface protection tape and cardboard boxes to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
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