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Aluminum Nitride (AlN) Ceramic Structural Components

HM1915

New product

Aluminum Nitride (AlN) Ceramic Structural Components exhibit exceptional thermal conductivity, low dielectric constant, and minimal dielectric loss, making them extensively utilized in the electronics industry. Heeger Materials can provide top-quality Aluminum Nitride (AlN) Ceramic Structural Components at a competitive price, with customized services to meet specific requirements.

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MaterialsAlN
SizeCustomized

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Aluminum Nitride (AlN) Ceramic Structural Components offer dependable insulation, outstanding mechanical properties, non-toxicity, high-temperature resistance, chemical resistance, and excellent resistance to plasma etching. The primary production method involves dry press molding. With a thermal conductivity of 170W / (mk), Aluminum Nitride (AlN) ceramics surpass alumina ceramics by 5-8 times. Consequently, AlN ceramics exhibit impressive thermal shock resistance, enabling their application in environments reaching temperatures up to 2200 ℃. 

Aluminum Nitride (AlN) Ceramic Structural Components

Aluminum Nitride (AlN) Ceramic Structural Components Selection Notes

Aluminum Nitride (AlN) Ceramic Structural Components belongs to the aluminum nitride products range and is selected for thermal conductivity, electrical insulation and useful ceramic stability. It is commonly used in project-specific assemblies, prototypes, replacement parts and drawing-based ceramic components as well as heat sinks, substrates, electronic packaging, ceramic fixtures and thermal management components. When requesting a quote, confirm drawings, dimensions, tolerances, material grade, surface finish, quantity and working environment.

Related Materials and Product Forms

For material comparison or adjacent product forms, browse AlN substrates, AlN heat sinks, technical ceramics and aluminum nitride products.

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What information is needed for a custom quote? Please provide drawings, dimensions, tolerances, material grade, surface finish, quantity and working environment so feasibility can be reviewed.

Aluminum Nitride (AlN) Ceramic Structural Components Properties

Item

Unit

Test Standard

Density

g/cm3

≥3.30

Melting Point

℃

2500

Thermal Conductivity

25℃ W/(m.k)

≥170

Dielectric Constant

1 MHz, 25℃

9

Dielectric Loss

1 MHz, 25℃

4.6×10-4

Dielectric Strength

Kv/mm

≥15

Flexural  Strength

Mpa

≥350

Elastic Modulus

GPa

310-320

Warpage

~/25(length)

0.002-0.005

Surface roughness

um

1.8

Coefficient of thermal expansion

20～300℃ (10-6/℃)

4.6

Volume resistivity

20℃.Ω.cm

1.5×1014

Water Absorption

%

0

Customized Solutions

HM provides customized services, processing specific shapes and sizes according to drawings.

Aluminum Nitride (AlN) Ceramic Structural Components

Aluminum Nitride (AlN) Ceramic Structural Components Applications

  • Radiators and heat sinks
  • Laser electrical insulators
  • Chucks, clamping rings for semiconductor processing equipment
  • Silicon wafer processing
  • Substrates and insulators for microelectronic and optoelectronic equipment
  • Electronic packaging substrates
  • Chip carriers for sensors and detectors

Aluminum Nitride (AlN) Ceramic Structural Components Packing

Aluminum Nitride (AlN) Ceramic Structural Components are carefully packaged with adhesive-free surface protection tape and cardboard boxes to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Aluminum Nitride (AlN) Ceramic Structure Components Packing

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