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Aluminum Nitride (AlN) Products
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Aluminum Nitride (AlN) Filler for Thermal Conductivity
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Aluminum Nitride Filler for thermal conductivity has excellent thermal conductivity and electrical insulation properties, which can effectively conduct heat and maintain the insulating properties of the material. Heeger Materials can provide top-quality AlN Filler for Thermal Conductivity at competitive prices, with customized services to meet specific requirements.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Data sheet
| Molecular Formula | AlN |
| Purity | 99.9% |
More info
Aluminum Nitride fillers for thermal conductivity can be added to base materials such as plastics, rubbers, and resins to enhance the thermal conductivity of these materials for electronic devices and industrial applications that require good heat dissipation properties.
Aluminum Nitride Filler for Thermal Conductivity Specifications
Product | HM-TLA02 | HM-TLA03 | HM-TLA05 | HM-TLA30 | HM-TLA50 | HM-TLA80 | HM-TLA100 |
AlN (wt%) | >99.9 | >99.9 | >99.9 | >96 | >96 | >96 | >96 |
O (wt%) | < 0.85 | < 0.85 | < 0.85 | < 2 | < 2 | < 2 | < 2 |
D50 /μm | 2±0.2 | 3±0.2 | 5±0.2 | 38±5 | 54±5 | 90±5 | 105±5 |
Particle shape | Spheroidal shape | Spheroidal shape | Spheroidal shape | Sphericity＞95% | Sphericity＞95% | Sphericity＞95% | Sphericity＞95% |
Specific area (m2/g) | 1.9±0.2 | 1.2±0.2 | 1.0±0.2 | / | / | / | / |
Apparent density (g/cm3) | / | / | / | 1.4~1.6 | 1.6~1.8 | 1.7~1.8 | 1.7~1.8 |
Tap density (g/cm3) | 0.7±0.2 | 1.0±0.2 | 1.2±0.2 | 1.9±0.2 | 2.0±0.2 | 2.1±0.2 | 2.2±0.2 |
Aluminum Nitride Filler for Thermal Conductivity SEM
HM-TLA02, HM-TLA03, and HM-TLA05 are directly synthesized aluminum nitride single-crystal polymers with a spheroidal shape.
HM-TLA30, HM-TLA50, HM-TLA80, and HM-TLA100 are aluminum nitride ceramic spheres formed by spray granulation and high-temperature sintering in a spherical shape.
Aluminum Nitride Filler Applications
- Electronic Products: Used as thermal interface material (TIM) fillers, improving the heat dissipation efficiency of electronic devices.
- Thermal Plastics: Used to manufacture thermal plastics and rubbers.
- Ceramic Substrates: Used to manufacture Aluminum Nitride Ceramic Substrates with high thermal conductivity.
- High-temperature Structural Ceramics: Used to manufacture high-temperature and corrosion-resistance Aluminum Nitride Structural Ceramic Components.
Aluminum Nitride Filler for Thermal Conductivity Packing
Aluminum Nitride (AlN) Filler for Thermal Conductivity should be stored in a sealed container in a dry and cool place, and should not be exposed to air for an extended period. HM offers vacuum-sealed packaging including 100g/bag, 500g/bag, 1kg/bag, and 25kg/drum, or customized packaging as per specific requirements.
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