Aluminum Nitride (AlN) Products

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Aluminum Nitride (AlN) Filler for Thermal Conductivity

Reference: HM1913

Condition: New product

Aluminum Nitride Filler for thermal conductivity has excellent thermal conductivity and electrical insulation properties, which can effectively conduct heat and maintain the insulating properties of the material. Heeger Materials can provide top-quality AlN Filler for Thermal Conductivity at competitive prices, with customized services to meet specific requirements.

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Data sheet

Molecular Formula	AlN
Purity	99.9%

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Aluminum Nitride fillers for thermal conductivity can be added to base materials such as plastics, rubbers, and resins to enhance the thermal conductivity of these materials for electronic devices and industrial applications that require good heat dissipation properties.

Aluminum Nitride (AlN) Filler for Thermal Conductivity

Aluminum Nitride Filler Specifications

Product	HM-TLA02	HM-TLA03	HM-TLA05	HM-TLA30	HM-TLA50	HM-TLA80	HM-TLA100
AlN (wt%)	>99.9	>99.9	>99.9	>96	>96	>96	>96
O (wt%)	< 0.85	< 0.85	< 0.85	< 2	< 2	< 2	< 2
D50 /μm	2±0.2	3±0.2	5±0.2	38±5	54±5	90±5	105±5
Particle shape	Spheroidal shape	Spheroidal shape	Spheroidal shape	Sphericity＞95%	Sphericity＞95%	Sphericity＞95%	Sphericity＞95%
Specific area (m2/g)	1.9±0.2	1.2±0.2	1.0±0.2	/	/	/	/
Apparent density (g/cm3)	/	/	/	1.4~1.6	1.6~1.8	1.7~1.8	1.7~1.8
Tap density (g/cm3)	0.7±0.2	1.0±0.2	1.2±0.2	1.9±0.2	2.0±0.2	2.1±0.2	2.2±0.2

Aluminum Nitride Filler SEM

HM-TLA02, HM-TLA03, and HM-TLA05 are directly synthesized aluminum nitride single-crystal polymers with a spheroidal shape.

Aluminum Nitride (AlN) Powder For thermally Conductive Filler SEM

HM-TLA30, HM-TLA50, HM-TLA80, and HM-TLA100 are aluminum nitride ceramic spheres formed by spray granulation and high-temperature sintering in a spherical shape.

Aluminum Nitride (AlN) Powder for Thermally Conductive Fillers SEM

Aluminum Nitride Filler Features

High thermal conductivity
High flowability
High fillability
Small specific surface area
Narrow Particle size distribution
Inorganic surface treatment, hygrolysis resistance >20H in a 80℃ water bath
Ammonia gas removal
Easy to store

Aluminum Nitride Filler Applications

Electronic Products: Used as thermal interface material (TIM) fillers, improving the heat dissipation efficiency of electronic devices.
Thermal Plastics: Used to manufacture thermal plastics and rubbers.
Ceramic Substrates: Used to manufacture Aluminum Nitride Ceramic Substrates with high thermal conductivity.
High-temperature Structural Ceramics: Used to manufacture high-temperature and corrosion-resistant Aluminum Nitride Structural Ceramic Components.

Aluminum Nitride Filler Packing

Aluminum Nitride (AlN) Filler for Thermal Conductivity should be stored in a sealed container in a dry and cool place, and should not be exposed to air for an extended period. HM offers vacuum-sealed packaging, including 100g/bag, 500g/bag, 1kg/bag, and 25kg/drum, or customized packaging as per specific requirements.

Aluminum Nitride (AlN) Filler for Thermal Conductivity Packing

Where to Buy Aluminum Nitride Filler in Bulk?

Heeger Materials Inc., a professional supplier and manufacturer of high-quality Aluminum Nitride (AlN) Products including Aluminum Nitride Filler, leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.

Heeger Materials Inc. was established in 2016 in Colorado, USA. We specialize in premium-grade metals, alloys, ceramics, powders, and other materials catering to research, development, and large-scale industrial production in scientific and industrial sectors.

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