New Aluminum Nitride (AlN) Filler for Thermal Conductivity-Heeger Materials Inc View larger

Aluminum Nitride (AlN) Filler for Thermal Conductivity

New product

Aluminum Nitride Filler for thermal conductivity has excellent thermal conductivity and electrical insulation properties, which can effectively conduct heat and maintain the insulating properties of the material. Heeger Materials can provide top-quality AlN Filler for Thermal Conductivity at competitive prices, with customized services to meet specific requirements.

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Data sheet

MFAlN
Purity99.9%

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Aluminum Nitride fillers for thermal conductivity can be added to base materials such as plastics, rubbers, and resins to enhance the thermal conductivity of these materials for electronic devices and industrial applications that require good heat dissipation properties.

Aluminum Nitride (AlN) Filler for Thermal Conductivity

Aluminum Nitride Filler for Thermal Conductivity Specifications

Product

HM-TLA02

HM-TLA03

HM-TLA05

HM-TLA30

HM-TLA50

HM-TLA80

HM-TLA100

AlN (wt%)

>99.9

>99.9

>99.9

>96

>96

>96

>96

O (wt%)

< 0.85

< 0.85

< 0.85

< 2

< 2

< 2

< 2

D50 /μm

2±0.2

3±0.2

5±0.2

38±5

54±5

90±5

105±5

Particle shape

Spheroidal shape

Spheroidal shape

Spheroidal shape

Sphericity>95%

Sphericity>95%

Sphericity>95%

Sphericity>95%

Specific area (m2/g)

1.9±0.2

1.2±0.2

1.0±0.2

/

/

/

/

Apparent density (g/cm3)

/

/

/

1.4~1.6

1.6~1.8

1.7~1.8

1.7~1.8

Tap density (g/cm3)

0.7±0.2

1.0±0.2

1.2±0.2

1.9±0.2

2.0±0.2

2.1±0.2

2.2±0.2

Aluminum Nitride Filler for Thermal Conductivity SEM

HM-TLA02, HM-TLA03, and HM-TLA05 are directly synthesized aluminum nitride single-crystal polymers with a spheroidal shape.

Aluminum Nitride (AlN) Powder For thermally Conductive Filler SEM

HM-TLA30, HM-TLA50, HM-TLA80, and HM-TLA100 are aluminum nitride ceramic spheres formed by spray granulation and high-temperature sintering in a spherical shape.

Aluminum Nitride (AlN) Powder for Thermally Conductive Fillers SEM

Aluminum Nitride Filler Applications

  • Electronic Products: Used as thermal interface material (TIM) fillers, improving the heat dissipation efficiency of electronic devices.
  • Thermal Plastics: Used to manufacture thermal plastics and rubbers.
  • Ceramic Substrates: Used to manufacture Aluminum Nitride Ceramic Substrates with high thermal conductivity.
  • High-temperature Structural Ceramics: Used to manufacture high-temperature and corrosion-resistance Aluminum Nitride Structural Ceramic Components.

Aluminum Nitride Filler for Thermal Conductivity Packing

Aluminum Nitride (AlN) Filler for Thermal Conductivity should be stored in a sealed container in a dry and cool place, and should not be exposed to air for an extended period. HM offers vacuum-sealed packaging including 100g/bag, 500g/bag, 1kg/bag, and 25kg/drum, or customized packaging as per specific requirements.

Aluminum Nitride (AlN) Filler for Thermal Conductivity Packing

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