Viewed products
-
Aluminum Nitride (AlN)...
Aluminum Nitride Filler for thermal...
Aluminum Nitride (AlN) Products
View larger 
Aluminum Nitride (AlN) Filler for Thermal Conductivity
New product
Aluminum Nitride Filler for thermal conductivity has excellent thermal conductivity and electrical insulation properties, which can effectively conduct heat and maintain the insulating properties of the material. Heeger Materials can provide the best Aluminum Nitride Filler for Thermal Conductivity at a competitive price. We can provide customized services according to specific requirements.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Data sheet
| MF | AlN |
| Purity | 99.9% |
More info
Aluminum Nitride fillers for thermal conductivity can be added to base materials such as plastics, rubbers, and resins to enhance the thermal conductivity of these materials for electronic devices and industrial applications that require good heat dissipation properties.
Aluminum Nitride Filler for Thermal Conductivity Specifications
Product | HM-TLA02 | HM-TLA03 | HM-TLA05 | HM-TLA30 | HM-TLA50 | HM-TLA80 | HM-TLA100 |
AlN (wt%) | >99.9 | >99.9 | >99.9 | >96 | >96 | >96 | >96 |
O (wt%) | < 0.85 | < 0.85 | < 0.85 | < 2 | < 2 | < 2 | < 2 |
D50 /μm | 2±0.2 | 3±0.2 | 5±0.2 | 38±5 | 54±5 | 90±5 | 105±5 |
Particle shape | Spheroidal shape | Spheroidal shape | Spheroidal shape | Sphericity＞95% | Sphericity＞95% | Sphericity＞95% | Sphericity＞95% |
Specific area (m2/g) | 1.9±0.2 | 1.2±0.2 | 1.0±0.2 | / | / | / | / |
Apparent density (g/cm3) | / | / | / | 1.4~1.6 | 1.6~1.8 | 1.7~1.8 | 1.7~1.8 |
Tap density (g/cm3) | 0.7±0.2 | 1.0±0.2 | 1.2±0.2 | 1.9±0.2 | 2.0±0.2 | 2.1±0.2 | 2.2±0.2 |
Aluminum Nitride Filler for Thermal Conductivity SEM
HM-TLA02, HM-TLA03, and HM-TLA05 are directly synthesized aluminum nitride single-crystal polymers with a spheroidal shape.
HM-TLA30, HM-TLA50, HM-TLA80, and HM-TLA100 are aluminum nitride ceramic spheres formed by spray granulation and high-temperature sintering in a spherical shape.
Aluminum Nitride Filler for Thermal Conductivity Packing
Aluminum Nitride (AlN) Filler for Thermal Conductivity should be stored in a sealed container in a dry and cool place, and should not be exposed to air for an extended period. We offer vacuum-sealed packaging including 100g/bag, 500g/bag, 1kg/bag, and 25kg/drum, or we can offer customized packaging as per specific requirements.
Inquiry to Heeger Materials
Items marked with an asterisk (*) are required.
Heeger Materials respects your privacy, and we will NOT sell or provide your personal data to other third parties, or allow them to use your personal data for their own purposes. However, we would like to send you information from time to time by mail or email about our products and special offers in addition to the interest categories you've selected above. Read our Privacy Policy
