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Aluminum Nitride (AlN) Surface Modification Powder
New product
Aluminum Nitride (AlN) Surface Modification Powder is treated with an acid solution to form a protective film on the surface of AlN particles by esterifying the hydroxyl group with the acid. Heeger Materials can provide top-quality Aluminum Nitride (AlN) Modification Powder at competitive prices, with customized options for particle size to meet specific requirements.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Data sheet
| Particle Size | Customized |
| Molecular Formula | AlN |
More info
The Aluminum Nitride (AlN) Surface Modification Powder undergoes specialized surface treatment to improve its resistance to hydrolysis and dispersibility, rendering it particularly suitable for electronic packaging, thermal interface materials, high thermal conductivity plastics, and rubbers.
Aluminum Nitride (AlN) Surface Modification Powder Specifications
Item | HM-F1T08 | HM-F120T01 | |
D50 (μm) | 1.41 | 121.6 | |
Specific area (m2/g) | 1.28 | 0.01 | |
Impurity Content | O (%) | 0.93 | 1.41 |
Ca (ppm) | <300 | <300 | |
Fe (ppm) | <25 | <50 | |
Si (ppm) | <20 | <30 | |
Apparent density (g/cm3) | 1.05 | 1.81 | |
Tap density (g/cm3) | 1.64 | 2.04 | |
Moisture (%) | 0.02 | 0.02 | |
Aluminum Nitride (AlN) Surface Modification Powder SEM
Aluminum Nitride (AlN) Surface Modification Powder Advantages
- High resistance to hydrolysis
- Excellent hydrophobicity
- High thermal conductivity
Aluminum Nitride (AlN) Surface Modification Powder Applications
- Thermal Interface material
- Semiconductor Packaging
- Metal substrates coating
- Thermal engineering plastics
Aluminum Nitride (AlN) Surface Modification Powder Packing
Aluminum Nitride (AlN) Surface Modification Powder should be stored in a sealed container in a dry and cool place and not exposed to air for an extended period. HM offers vacuum-sealed packaging including 100g/bag, 500g/bag, 1kg/bag, and 25kg/drum, or customized packaging as per specific requirements.
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