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Aluminum Nitride Electrostatic Chuck, AlN Ceramic

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Aluminum Nitride (AlN) Electrostatic Chuck is used in various semiconductor processes to secure wafers during processing.  Heeger Materials provides top-quality Aluminum Nitride Electrostatic Chuck at competitive prices, offering specialized and customized services to meet specific requirements.

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Data sheet

MaterialsAlN
SizePer request or drawing

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Aluminum Nitride (AlN) Electrostatic Chuck utilizes a platen with integrated electrodes, applying high voltage bias between the platen and the wafer to establish electrostatic holding force, thus securing the wafer in place, achieving precise positioning and control. The high thermal conductivity and insulation properties of aluminum nitride ceramics make it suitable as a dielectric material for separating conductive electrodes. HM also can offer high-quality Aluminum Oxide (Al2O3) Electrostatic Chuck at competitive prices, with customized options to meet specific requirements.

HM can provide various high-quality Aluminum Nitride (AlN) Ceramic Products with precise tolerances and finely ground or polished surfaces, such as AlN Rods, AlN Tubes, AlN Rings, AlN Substrates, AlN Structural Components, AlN Heaters, AlN Heat Sinks, AlN Crucibles, AlN Discs, AlN Custom Parts, etc. 

Aluminum Nitride Electrostatic Chuck, AlN Ceramic

Aluminum Nitride Electrostatic Chuck Specifications

Properties

Unit

Value

Purity

wt%

95%AlN+%Y2O3

Density

g/cm3

3.32

Bending Strength

Mpa

410

Young's Modulus

Gpa

>320

Hardness HV1

-

1000

Maximum Service Temperature in Air

800

Linear Coefficient of Expansion (40 – 400℃)

10-6/ K

4.6

Linear Coefficient of Expansion (40 – 800℃)

10-6/ K

5.3

Specific Heat

J / (kg·K)

740

Thermal Conductivity 100℃

W/m·k

≥170

Resistivity 20℃

Ω·cm

1x1014

Resistivity 300℃

Ω·cm

1x1012

Resistivity 500℃

Ω·cm

1x1010

Volume Resistivity

Ohm-cm

1x1014

Dielectric Strength

KV/mm

>15

Dielectric Constant

1 MHz

>8.6

*Customized services can be available according to specific drawings.

Aluminum Nitride Electrostatic Chuck Features

  • High thermal conductivity
  • Low coefficient of thermal expansion
  • Good electrical insulation and resistivity
  • Low dielectric constant
  • High mechanical strength under compression load
  • Corrosion-resistant (gas)
  • Good thermal shock resistance

Aluminum Nitride Electrostatic Chuck Application

  • Semiconductor industry: Used in wafer processing, such as etching, chemical vapor deposition, and ion implantation in semiconductor processes.

Aluminum Nitride Electrostatic Chuck Packing

Aluminum Nitride (AlN) Electrostatic Chuck is carefully packaged with adhesive-free surface protection tape and cardboard boxes to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Aluminum Nitride (AlN) Electrostatic Chuck Packing

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