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Metalized Aluminum Nitride Substrate | AlN Substrate

HM2866

New product

Metalized Aluminum Nitride (AlN) Substrate features excellent thermal conductivity, electrical insulation, and mechanical strength, making it ideal for high-power electronic and RF applications. It provides a stable platform for advanced circuits, ensuring reliable performance in demanding environments. 

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Data sheet

MaterialsMetallized AlN Substrate

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Metalized Aluminum Nitride (AlN) Substrate is a high-performance ceramic material known for its exceptional thermal conductivity, electrical insulation, and mechanical stability. It is widely used in power electronics, RF devices, and semiconductor packaging, where efficient heat dissipation and electrical reliability are critical. The metalized surface allows for secure bonding and improved electrical connections, making it suitable for applications such as LED modules, high-frequency circuits, and power semiconductor devices. In addition to Metalized Aluminum Nitride Substrate, we also offer AlN Ceramic Substrate and AlN Single Crystal Substrate to meet various application needs. Heeger Materials provides high-quality Metalized Aluminum Nitride Substrate with customizable specifications to meet diverse industry requirements.

Metalized Aluminum Nitride Substrate | AlN Substrate

Metalized Aluminum Nitride Substrate Stock Specifications

Model

Material Type

Bulk Resistivity

Sheet Resistance

Adhesion

Solderability

Maximum Size

Remarks

SD5121

Thick Film Pd-Ag

20

>1.5

Excellent

Excellent

50×50 mm²

-

SD5122

Thick Film W or Mo

25

>1.5

Excellent

Excellent

50×50 mm²

Post-plated with Ni

SD5131

Thin Film Ti/Cu/Ni/Au

<5

>2.5

Excellent

Excellent

50×50 mm²

Suitable for power electronic devices

SD5132

Thin Film Ta₂N/Ni

<5

>2.5

Excellent

Excellent

50×50 mm²

Suitable for microwave devices

SD5140

Direct Cu Bonding

<0.1

2.5

Excellent

Excellent

50×50 mm²

Also known as DBC

Metalized Aluminum Nitride Substrate Applications

  • Power Electronics: Used in high-power semiconductor modules, IGBT substrates, and power amplifiers for efficient heat dissipation.
  • RF and Microwave Devices: Provides excellent thermal and electrical performance for RF power transistors, microwave circuits, and antennas.
  • LED Packaging: Enhances thermal management and reliability in high-power LED applications.
  • Aerospace and Defense: Utilized in radar systems, satellite communication, and military-grade electronics requiring high thermal stability.
  • Automotive Electronics: Supports advanced driver-assistance systems (ADAS), electric vehicle power modules, and other high-performance automotive components.

Metalized Aluminum Nitride Substrate Packing And Shipping

Metalized Aluminum Nitride (AlN) Substrate will be securely packaged in sturdy containers with cushioning materials to prevent movement or damage during shipping. This careful packaging ensures that the product arrives in perfect condition, maintaining its high-quality standards throughout the delivery process.

Metalized Aluminum Nitride Substrate | AlN Substrate Packing

Where to Buy Metalized Aluminum Nitride Substrate in Bulk?

Heeger Materials Inc., a professional supplier and manufacturer of high-quality Ceramic Substrate products including Metalized Aluminum Nitride (AlN) Substrate, leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.

Heeger Materials Inc. was established in 2016 in Colorado, USA. We specialize in premium-grade metals, alloys, ceramics, powders, and other materials catering to research, development, and large-scale industrial production in scientific and industrial sectors. 

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