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orning 7980 Glass Substrate is a...
HM2866
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orning 7980 Glass Substrate is a high-purity synthetic fused silica with excellent optical and thermal properties, featuring over 90% transmittance from 200 nm to 2500 nm. It offers low thermal expansion, strong durability, and is available in various grades for photonics and semiconductor applications.
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Density | 2.201 g/cm3 |
The quality of HPFS glass is defined and certified by two key standards: inclusion class and homogeneity grade.
Inclusion Class | Homogeneity (ppm) | |||||||||
Grade | ||||||||||
Class | Total Inclusion Cross Section (mm²) | Maximum Size (mm) | AA (≤ 0.5) | A (≤ 1) | B (≤ 1.5) | C (≤ 2) | D (≤ 3) | E (≤ 4) | F (≤ 5) | G (NS) |
0 | ≤ 0.03 | 0.10 | √ | √ | √ | √ | √ | √ | √ | √ |
1 | ≤ 0.10 | 0.28 |
| √ | √ | √ | √ | √ | √ | √ |
2 | ≤ 0.25 | 0.50 |
|
| √ | √ | √ | √ | √ | √ |
3 | ≤ 0.50 | 0.76 |
|
|
| √ | √ | √ | √ | √ |
4 | ≤ 1.00 | 1.00 |
|
|
| √ | √ | √ | √ | √ |
5 | ≤ 2.00 | 1.27 |
|
|
| √ | √ | √ | √ | √ |
Young's Modulus | 72.7 GPa | ||
Shear Modulus | 31.4 GPa | ||
Modulus of Rupture | 52.4 MPa | ||
Bulk Modulus | 35.4 GPa | ||
Poisson's Ratio | 0.16 | ||
Density | 2.201 g/cm³ | ||
Knoop Hardness (100 g) | 522 kg/mm² | ||
Softening Point | 1585°C (10⁷·⁶ poises) | ||
Annealing Point | 1042°C (10¹³ poises) | ||
Strain Point | 893°C (10¹⁴·⁵ poises) | ||
Thermal Conductivity | 1.30 W/m·K | ||
Thermal Diffusivity | 0.0075 cm²/s | ||
Average Thermal Expansion | 5°C-35°C | 0.52 ppm/K | |
0°C-200°C | 0.57 ppm/K | ||
-100°C-200°C | 0.48 ppm/K |
Solution | Test Conditions | Weight Loss (mg/cm²) |
5% HCl | @ 95°C, 24 hours | <0.010 |
5% NaOH | @ 95°C, 6 hours | 0.453 |
0.02N Na₂CO₃ | @ 95°C, 6 hours | 0.065 |
0.02N H₂SO₄ | @ 95°C, 24 hours | <0.010 |
Deionized Water (H₂O) | @ 95°C, 24 hours | 0.015 |
10% HF | @ 25°C, 20 minutes | 0.230 |
10% NH₄F·HF | @ 25°C, 20 minutes | 0.220 |
Impurities | OH Content | 800–1000 ppm |
Other Impurities | ≤ 1000 ppb |
Specification (Unit) | 4" | 6" | 8" | 10" | 12" |
Diameter (mm)/Size(or square) | 100 | 150 | 200 | 250 | 300 |
Tolerance (mm) | ±0.2 | ±0.2 | ±0.2 | ±0.2 | ±0.2 |
Thickness (mm) | ≥0.10 | ≥0.30 | ≥0.40 | ≥0.50 | ≥0.50 |
Primary Flat (mm) | 32.5 | 57.5 | Semi-notch | Semi-notch | Semi-notch |
Local Thickness Variation (LTV, 5mm×5mm, µm) | <0.5 | <0.5 | <0.5 | <0.5 | <0.5 |
Total Thickness Variation (TTV, µm) | <2 | <3 | <3 | <5 | <5 |
Bow (µm) | ±20 | ±30 | ±40 | ±40 | ±40 |
Warp (µm) | ≤30 | ≤40 | ≤50 | ≤50 | ≤50 |
PLTV (5mm×5mm, <0.4µm, %) | ≥95% | ≥95% | ≥95% | ≥95% | ≥95% |
Edge Rounding (mm) | Complies with SEMI M1.2 standard or IEC62276 reference | ||||
Surface Type | Single-side polished or double-side polished | ||||
Polished Surface Roughness (Ra, nm) | ≤1 | ||||
Backside Standard (µm) | Typically 0.2-0.7, or customizable as needed |
HPFS Standard Grade ensures an external transmittance (T external) of ≥80%/cm and an internal transmittance (T internal) of ≥88%/cm at 185 nm. These values are derived from precise testing on polished, uncoated samples under controlled laboratory conditions. Below is a typical internal transmittance curve for HPFS Standard Grade fused silica.
Corning 7980 Glass Substrate will be securely packaged in sturdy containers with cushioning materials to prevent movement or damage during shipping. This careful packaging ensures that the product arrives in perfect condition, maintaining its high-quality standards throughout the delivery process.
Heeger Materials Inc., a professional supplier and manufacturer of high-quality Conductive Glass Substrates products including Corning 7980 Glass Substrate, leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.
Heeger Materials Inc. was established in 2016 in Colorado, USA. We specialize in premium-grade metals, alloys, ceramics, powders, and other materials catering to research, development, and large-scale industrial production in scientific and industrial sectors.
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