Copper Silicide (Cu5Si) Powder is a type of intermetallic compound, representing an intermediate state between an ionic compound and an alloy. It features insolubility in water and showcases exceptional electrical and thermal conductivity, ductility, corrosion resistance, and abrasion resistance. This material is widely employed in the formulation of thermally conductive materials and serves as a heat sink in electronic devices.

• Formula: Cu5Si
• Density: 7.8g/cm³
• Melting point: 825℃
• Molecular weight: 345.81g/mol
• CAS: 12159-07-8

Copper Silicide Powder Specifications

Copper Silicide Powder SEM

Copper Silicide Powder Features

• Excellent electrical and thermal conductivity
• Excellent corrosion and abrasion resistance
• Excellent ductility 

Copper Silicide Powder Applications

• Copper silicide films are used to passivate copper-based chips to suppress their diffusion and electron migration and as diffusion barrier layers. 
• Used in the direct industrial synthesis of organosilicon compounds
• Used to silicify chloromethanes

Copper Silicide Powder Storage and Packing

Copper Silicide (Cu5Si) Powder should be kept sealed and stored in a dry and cool place, avoiding heavy pressure and oxidizing agents. The powder is available in vacuum-sealed packaging options of 100g/bag, 500g/bag, 1kg/bag, 25kg/drum, or customized as per specific requirements.