Copper Silicide (Cu5Si) Powder has properties between those of an ionic compound and an alloy. Heeger Materials can provide high-quality Copper Silicide (Cu5Si) Powder at a competitive price.

• Formula: Cu5Si
• Density: 7.8g/cm³
• Melting point: 825℃
• Molecular weight: 345.81g/mol
• CAS: 12159-07-8

Copper Silicide Powder Chemical Analysis

Copper Silicide Powder Properties

• Excellent electrical and thermal conductivity
• Excellent corrosion and abrasion resistance
• Excellent ductility 

Copper Silicide Powder Applications

• Copper silicide films are used to passivate copper-based chips for suppressing their diffusion and electron migration and as diffusion barrier layers. 
• Used in the direct industrial synthesis of organosilicon compounds
• Used to silicify chloromethanes

Copper Silicide Powder Storage and Packing

Copper Silicide (Cu5Si) Powder should keep sealed and stored in a dry and cool place, avoiding being exposed to air. The vacuum packing is 1kg/bag, 25kg/drum, or as required.