Aluminum Silicon Carbide is a metal-ceramic composite material consisting of silicon carbide particles dispersed in a matrix of aluminum alloy. With its composite features, Al-SiC is an advanced packaging material for high-technology thermal management and allows for a new packaging technology that can replace traditional W-Cu, Mo, Mo-Cu, BeO, Kovar, AlN, AlSi, Al2O3. HM can supply high-precision and competitively priced Al-SiC substrates with tight tolerances according to specific drawings. Various specifications are available for choices.

Aluminum Silicon Carbide (Al-SiC) Substrate Specification

Aluminum Silicon Carbide (Al-SiC) Substrate Advantages

• AlSiC has high thermal conductivity (170~220W/m·K), which is ten times higher than that of general encapsulation materials, allowing for efficient heat dissipation from the chip and enhancing the reliability and stability of the whole component.
• AlSiC is a composite material with a thermal expansion coefficient (6.5 ~ 9.5 × 10-6/K) and other properties can be adjusted by changing its composition, enabling a good match with semiconductor chips and ceramic substrates to prevent fatigue failure. It can even be directly mounted on the power chips.
• AlSiC is very light, only 1/3 of copper and about the same as aluminum, but the flexural strength is as good as steel. This makes it excellent in terms of vibration resistance, surpassing copper backplanes.
• AlSiC exhibits the highest specific stiffness of any electronic material—three times that of aluminum, five times that of W-Cu and Kovar, and 25 times that of copper. Its superior vibration resistance makes it ideal for harsh environments, such as aerospace and automotive applications.
• AlSiC can be processed in large quantities, with the method depending on the silicon carbide content, utilizing techniques such as EDM, diamond machining, laser cutting, etc.
• AlSiC can be plated with nickel, gold, tin, etc. The surface can also be anodized.
• Metalized ceramic substrates can be brazed to plated AlSiC, while printed circuit board cores can be bonded using binders and resins.
• AlSiC itself has good hermeticity. However, the hermeticity after encapsulation with metal or ceramic electronics depends on proper plating and soldering.
• The physical and mechanical properties of AlSiC are isotropic.

Aluminum Silicon Carbide (Al-SiC) Substrate Applications

AlSiC substrate as the base plate of the IGBT module has significant advantages in improving heat dissipation efficiency, enhancing reliability, reducing weight, etc. IGBT modules encapsulated with AlSiC substrate are widely used in the following fields:

• High-speed rail
• Subway
• New energy vehicles
• Wind power generation
• Aerospace

Where to Buy Aluminum Silicon Carbide (Al-SiC) Substrate in Bulk?

Heeger Materials Inc., a professional supplier and manufacturer of high-quality Silicon Carbide Ceramic products, including Aluminum Silicon Carbide (Al-SiC) Substrate, leverages extensive expertise in supply and export to offer competitive prices. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.

Heeger Materials Inc. was established in 2016 in Colorado, USA. We are a specialized supplier of premium-grade metals, alloys, ceramics, powders, and other materials catering to research, development, and large-scale industrial production in scientific and industrial sectors.