Molybdenum-copper (MoCu) alloy features an adjustable thermal expansion coefficient and thermal conductivity. The molybdenum to copper ratio is customizable, offering lower density but a higher thermal expansion coefficient than tungsten-copper (WCu) alloy. Its superior rollability makes it suitable for thin strip production and stamping, enabling cost-effective, high-volume production of heat-sinkable parts. Consequently, MoCu alloy is more suited for aerospace and other industries.

Molybdenum Copper Alloy Specifications

*The ratio of Molybdenum to Copper can be tailored according to specific requirements.

Molybdenum Copper Alloy Features

• High conductivity
• Adjustable low coefficient of thermal expansion
• Non-magnetic
• Low gas content
• Good vacuum properties
• Good machinability and special high-temperature properties

Molybdenum Copper Alloy Applications

• Microwave carriers
• Ceramic substrate carriers
• Laser diode mounts
• Optical packages
• Power packages
• Butterfly packages
• Crystal carriers for solid-state lasers

Molybdenum Copper Alloy Packing

Molybdenum Copper Alloy is tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage caused during storage or transportation.