Blog Categories

Sale!

View larger

Copper Clad Molybdenum (CMC,CuMoCu) Laminates Alloy

Reference: HTMO1095

Condition: New product

Copper Clad Molybdenum Cu/Mo/Cu (CMC) Allloy is a sandwich structured and flat-panel composite material, which comprises a molybdenum core layer and two copper clad layers. It has adjustable CTE, high thermal conductivity, and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.

More details

Inquiry
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Send to a friend
Send to a friend

Copper Clad Molybdenum (CMC,CuMoCu) Laminates Alloy
Copper Clad Molybdenum Cu/Mo/Cu (CMC) Allloy is a sandwich structured and flat-panel composite material, which comprises a molybdenum core layer and two copper clad layers. It has adjustable CTE, high thermal conductivity, and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
Recipient :
Name of your friend ^* :
E-mail address of your friend ^* :
^* Required fields
or Cancel
Print

Data sheet

Materials	Cu/Mo/Cu: 111,121,131,141,13/74/13
Dimensions	Customized

More info

Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material and is covered with pure copper or dispersion strengthened copper on both sides. Besides, the copper-molybdenum copper heat sink has an adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.

CMC Product Properties

CMC111 means the thickness of the layer, Cu:Mo: Cu = 1:1:1.

Grade	Density g/cm3	Coefficient of thermal Expansion ×10-6 (20℃)	Thermal conductivity W/(M·K)
CMC111	9.32	8.8	305（XY）/250（Z）
CMC121	9.54	7.8	260（XY）/210（Z）
CMC131	9.66	6.8	244（XY）/190（Z）
CMC141	9.75	6	220（XY）/180（Z）
CMC13/74/13	9.88	5.6	200（XY）/170（Z）

Cu/Mo/Cu(CMC) heat sink has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwaves, flanges, and frames for RF, laser diode packages, LED packages, BGA packages, and GaAs device mounts, etc. Copper Clad Molybdenum Alloy Applications

Inquiry to Heeger Materials

Items marked with an asterisk (*) are required.

Privacy Information:

Heeger Materials respects your privacy, and we will NOT sell or provide your personal data to other third parties, or allow them to use your personal data for their own purposes. However, we would like to send you information from time to time by mail or email about our products and special offers in addition to the interest categories you've selected above. Read our Privacy Policy