Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich-structured and flat-panel composite material. It uses pure molybdenum as the core material and is covered with pure copper or dispersion-strengthened copper on both sides. Besides, the copper-molybdenum copper heat sink has an adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.

HM can also provide S-CMC, a multi-layer structured CMC with improved symmetry to reduce stress and deformation, enhancing reliability. HS-CMC is a multi-layer composite sheet with molybdenum core material and perforations filled with oxygen-free copper, resulting in better thermal conductivity in the Z-direction. This effectively reduces thermal resistance and enhances heat transfer efficiency, making it suitable for high-frequency and high-power applications.

Copper Clad Molybdenum Materials Properties

CMC111 means the thickness of the layer, Cu:Mo:Cu = 1:1:1. 

Copper Molybdenum Copper Applications

Cu/Mo/Cu (CMC) heat sinks have similar applications to tungsten copper heat sinks.

Application field:

• Thermal mounting plates
• chip carriers for microwave components,
• flanges and frames for RF and laser diode packages
• LED packages, BGA packages, GaAs device mounts, etc.