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Copper Clad Molybdenum (CMC,CuMoCu) Laminates Alloy

Reference: HTMO1095

Condition: New product

Copper Clad Molybdenum Cu/Mo/Cu (CMC) Allloy is a sandwich structured and flat-panel composite material, which comprises a molybdenum core layer and two copper-clad layers. It has adjustable CTE, high thermal conductivity, and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.

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Data sheet

Materials	Cu/Mo/Cu: 111,121,131,141,13/74/13
Dimensions	Customized

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Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material and is covered with pure copper or dispersion strengthened copper on both sides. Besides, the copper-molybdenum copper heat sink has an adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.

Copper Clad Molybdenum Product Properties

CMC111 means the thickness of the layer, Cu:Mo: Cu = 1:1:1.

Grade	Density g/cm3	Coefficient of thermal Expansion ×10-6 (20℃)	Thermal conductivity W/(M·K)
CMC111	9.32	8.8	305（XY）/250（Z）
CMC121	9.54	7.8	260（XY）/210（Z）
CMC131	9.66	6.8	244（XY）/190（Z）
CMC141	9.75	6	220（XY）/180（Z）
CMC13/74/13	9.88	5.6	200（XY）/170（Z）

Copper Clad Molybdenum Cu/Mo/Cu(CMC) heat sink has similar applications to tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwaves, flanges, and frames for RF, laser diode packages, LED packages, BGA packages, GaAs device mounts, etc. Copper Clad Molybdenum Alloy Applications

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