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Copper Clad Molybdenum (CMC,CuMoCu) Laminates Alloy

HTMO1095

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Copper Clad Molybdenum (Cu/Mo/Cu) Alloy is a sandwich-structured composite material consisting of a molybdenum core layer and two copper-clad layers. It offers adjustable CTE, high thermal conductivity, and strength, and can be stamped into various components. Heeger Materials offers top-quality CMC products with different grades at competitive prices.

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Data sheet

MaterialsCu/Mo/Cu: 111,121,131,141,13/74/13, S-CMC5:1:5:1:5 (Cu5Mo1Cu5Mo1Cu5), S-CMC313-5 (Cu3Mo1Cu3Mo1Cu3), S-CMC612-5 (Cu6Mo1Cu2Mo1Cu6), HS-CMC
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Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich-structured and flat-panel composite material. It uses pure molybdenum as the core material and is covered with pure copper or dispersion-strengthened copper on both sides. Besides, the copper-molybdenum copper heat sink has an adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.

HM can also provide S-CMC, a multi-layer structured CMC with improved symmetry to reduce stress and deformation, enhancing reliability. HS-CMC is a multi-layer composite sheet with molybdenum core material and perforations filled with oxygen-free copper, resulting in better thermal conductivity in the Z-direction. This effectively reduces thermal resistance and enhances heat transfer efficiency, making it suitable for high-frequency and high-power applications.

CMC-CuMoCu Alloy

Copper Clad Molybdenum Materials Properties

CMC111 means the thickness of the layer, Cu:Mo:Cu = 1:1:1. 

Grade

Density g/cm3

Coefficient of thermal

Expansion ×10-6  (20)

Thermal conductivity W/(M·K)

CMC111

9.32

8.8

305XY/250Z

CMC121

9.54

7.8

260XY/210Z

CMC131

9.66

6.8

244XY/190Z

CMC141

9.75

6

220XY/180Z

CMC13/74/13

9.88

5.6

200XY/170Z

S-CMC5:1:5:1:5 (Cu5Mo1Cu5Mo1Cu5)

9.2

 12.8 (200℃)

6.1 (20-800℃)

350 (XY) /295 (Z)

Copper Clad Molybdenum Applications

Cu/Mo/Cu (CMC) heat sinks have similar applications to tungsten copper heat sinks.

Application field:

  • Thermal mounting plates
  • chip carriers for microwave components,
  • flanges and frames for RF and laser diode packages
  • LED packages, BGA packages, GaAs device mounts, etc.

Copper Clad Molybdenum Alloy Packing

The copper-clad molybdenum (Cu/Mo/Cu) Alloy is tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

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