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Copper Clad Molybdenum (CMC,CuMoCu) Laminates Alloy
HTMO1095
New product
Copper Clad Molybdenum Cu/Mo/Cu (CMC) Allloy is a sandwich structured and flat-panel composite material, which comprises a molybdenum core layer and two copper-clad layers. It has adjustable CTE, high thermal conductivity, and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Data sheet
| Materials | Cu/Mo/Cu: 111,121,131,141,13/74/13 |
| Size | Customized |
More info
Heeger Materials provides high-quality Copper molybdenum copper (Cu/Mo/Cu) products for research and industry purposes at the most competitive prices. We can provide Cu/Mo/Cu heat sinks with different grades according to your requirements.
Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich-structured and flat-panel composite material. It uses pure molybdenum as the core material and is covered with pure copper or dispersion-strengthened copper on both sides. Besides, the copper-molybdenum copper heat sink has an adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.
Copper Clad Molybdenum Materials Properties
CMC111 means the thickness of the layer, Cu:Mo:Cu = 1:1:1.
Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
CMC111 | 9.32 | 8.8 | 305（XY）/250（Z） |
CMC121 | 9.54 | 7.8 | 260（XY）/210（Z） |
CMC131 | 9.66 | 6.8 | 244（XY）/190（Z） |
CMC141 | 9.75 | 6 | 220（XY）/180（Z） |
CMC13/74/13 | 9.88 | 5.6 | 200（XY）/170（Z） |
Copper Molybdenum Copper Applications
Cu/Mo/Cu (CMC) heat sinks have similar applications to tungsten copper heat sinks.
Application field:
- Thermal mounting plates
- chip carriers for microwave components,
- flanges and frames for RF and laser diode packages
- LED packages, BGA packages, GaAs device mounts, etc.
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