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Cu/MoCu/Cu is a sandwich structured...
HTMO1094
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Cu/MoCu/Cu is a sandwich structured and flat-panel composite material, which comprises a molybdenum copper alloy core layer and two copper-clad layers. The normal proportion of MoCu alloy is Mo70Cu30, sometimes Mo50Cu50, and so on. The ratio of the CTE of Cu/MoCu/Cu is adjustable.
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Availability date: 03/01/2013
Materials | Cu/Mo70Cu/Cu: 1/4/1 |
Heeger Materials provides high-quality Copper Molybdenum Copper Copper(CU/MOCU/CU) products for research and industry purposes at the most competitive prices. We can provide CU/MOCU/CU heat sinks with different grades according to your requirements.
Cu/MoCu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper-clad layers. The ratio of the thickness in Cu:Mo-Cu: Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has a higher price-quality ratio.
Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
CPC141 | 9.5 | 7.3 | 280(XY)/170(Z) |
If you have an interest in other compositions of CPC like CPC232, CPC111, CPC300, and other contents, contact us.
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