Cu/MoCu/Cu (CPC) is a sandwich composite similar to Cu/Mo/Cu, consisting of a Mo-Cu alloy core layer and two copper-clad layers. The thickness ratio of Cu:Mo-Cu:Cu can be adjusted accordingly. With superior thermal conductivity compared to W(Mo)-Cu and Cu/Mo/Cu, CPC offers a cost-effective solution with a higher price-to-quality ratio.

Heeger Materials provides high-quality Copper Molybdenum Copper Copper(CU/MOCU/CU) products for research and industry purposes at the most competitive prices. We can provide CU/MOCU/CU heat sinks with different grades according to your requirements.

Copper Clad Molybdenum-Copper (CPC) Properties

If you have an interest in other compositions of CPC like CPC300, and other contents, contact us.

Copper Clad Molybdenum-Copper (CPC) Features

• It has a higher thermal conductivity than copper/molybdenum/copper materials.
• It can be stamped into parts to reduce the cost.
• It has strong interfacial bonding, that can withstand repeated impacts at 850℃.
• It has a designable coefficient of thermal expansion, compatible with semiconductors and ceramics.
• It is non-magnetic.

Copper Clad Molybdenum-Copper (CPC) Applications

• Thermal mounting plates
• Chip carriers for microwave components
• Flanges and frames for RF and laser diode packages, LED packages,
• BGA packages and GaAs device mounts etc.

Copper Clad Molybdenum-Copper (CPC) Packing

Copper Clad Molybdenum-Copper (CPC) is tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage caused during storage or transportation.