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Copper Clad Molybdenum-Copper (CPC ,Cu-MoCu-Cu) Laminates Alloy

HTMO1094

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Cu/MoCu/Cu is a flat-panel composite material with a sandwich structure, consisting of a molybdenum-copper alloy core layer and two copper-clad layers. The typical composition of the MoCu alloy is Mo70Cu30, although Mo50Cu50 and other variations are also used. The coefficient of thermal expansion (CTE) of Cu/MoCu/Cu can be adjusted according to specific requirements.

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Data sheet

MaterialsCu/Mo70Cu/Cu: 1/4/1, 2/3/2, 1/1/1, 2/1/2

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Cu/MoCu/Cu (CPC) is a sandwich composite similar to Cu/Mo/Cu, consisting of a Mo-Cu alloy core layer and two copper-clad layers. The thickness ratio of Cu:Mo-Cu:Cu can be adjusted accordingly. With superior thermal conductivity compared to W(Mo)-Cu and Cu/Mo/Cu, CPC offers a cost-effective solution with a higher price-to-quality ratio.

Heeger Materials provides high-quality Copper Molybdenum Copper Copper(CU/MOCU/CU) products for research and industry purposes at the most competitive prices. We can provide CU/MOCU/CU heat sinks with different grades according to your requirements.

Copper Clad Molybdenum-Copper (CPC, Cu-MoCu-Cu) Laminates Alloy

Copper Clad Molybdenum-Copper (CPC) Properties

Grade

Density g/cm3

Coefficient of thermal Expansion ×10-6  (20℃)

Thermal conductivity W/(M·K)

Tensile Strength (Mpa)

CPC141

9.5

7.3

280(XY)/170(Z)

380

CPC232

9.3

7.5/11.0/9.0

255

350

CPC111

9.2

9.5

260

310

CPC212

9.1

11.5

300

230

If you have an interest in other compositions of CPC like CPC300, and other contents, contact us.

Copper Clad Molybdenum-Copper (CPC) Features

  • It has a higher thermal conductivity than copper/molybdenum/copper materials.
  • It can be stamped into parts to reduce the cost.
  • It has strong interfacial bonding, that can withstand repeated impacts at 850℃.
  • It has a designable coefficient of thermal expansion and is compatible with semiconductors and ceramics.
  • It is non-magnetic.

Copper Clad Molybdenum-Copper (CPC) Applications

  • Thermal mounting plates
  • Chip carriers for microwave components
  • Flanges and frames for RF and laser diode packages, LED packages,
  • BGA packages and GaAs device mounts etc.

CPC Heat Spreader9.jpg  CPC Heat Spreader-CuMoCu

Copper Clad Molybdenum-Copper (CPC) Packing

Copper Clad Molybdenum-Copper (CPC) is tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage caused during storage or transportation.

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