Heeger Materials provides high-quality Copper Molybdenum Copper Copper(CU/MOCU/CU) products for research and industry purposes at the most competitive prices. We can provide CU/MOCU/CU heat sinks with different grades according to your requirements.

Cu/MoCu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper-clad layers. The ratio of the thickness in Cu:Mo-Cu: Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has a higher price-quality ratio.

Copper Clad Molybdenum-Copper (CPC) Properties

If you have an interest in other compositions of CPC like CPC232, CPC111, CPC300, and other contents, contact us.

Copper Clad Molybdenum-Copper (CPC) Applications

• Thermal mounting plates
• Chip carriers for microwave components
• Flanges and frames for RF and laser diode packages, LED packages,
• BGA packages and GaAs device mounts etc.