Cu/MoCu/Cu is a sandwich structured...
Cu/MoCu/Cu is a sandwich structured and flat-panel composite material, which comprises a molybdenum copper alloy core layer and two copper-clad layers. The normal proportion of MoCu alloy is Mo70Cu30, sometimes Mo50Cu50, and so on. The ratio of the CTE of Cu/MoCu/Cu is adjustable.
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Availability date: 03/01/2013
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Cu/MoCu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper-clad layers. The ratio of the thickness in Cu:Mo-Cu: Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has a higher price-quality ratio.
Coefficient of thermal
Expansion ×10-6 (20℃)
Thermal conductivity W/(M·K)
If you have an interest in other compositions of CPC like CPC232, CPC111, CPC300, and other contents, contact us.
Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges, and frames for RF, laser diode packages, LED packages, BGA packages, and GaAs devices mounts, etc.
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