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Copper Clad Molybdenum-Copper (CPC ,Cu-MoCu-Cu) Laminates Alloy


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Cu/MoCu/Cu is a sandwich structured and flat-panel composite material, which comprises a molybdenum copper alloy core layer and two copper-clad layers. The normal proportion of MoCu alloy is Mo70Cu30, sometimes Mo50Cu50, and so on. The ratio of the CTE of Cu/MoCu/Cu is adjustable.

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Data sheet

MaterialsCu/Mo70Cu/Cu: 1/4/1

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Heeger Materials provides high-quality Copper Molybdenum Copper Copper(CU/MOCU/CU) products for research and industry purposes at the most competitive prices. We can provide CU/MOCU/CU heat sinks with different grades according to your requirements.

Cu/MoCu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper-clad layers. The ratio of the thickness in Cu:Mo-Cu: Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has a higher price-quality ratio.

Copper Clad Molybdenum-Copper (CPC) Properties


Density g/cm3

Coefficient of thermal

Expansion ×10-6  (20℃)

Thermal conductivity W/(M·K)





If you have an interest in other compositions of CPC like CPC232, CPC111, CPC300, and other contents, contact us.

Copper Clad Molybdenum-Copper (CPC) Applications

  • Thermal mounting plates
  • Chip carriers for microwave components
  • Flanges and frames for RF and laser diode packages, LED packages,
  • BGA packages and GaAs device mounts etc.

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