Ti-Ni Shape Memory Alloy Capillary Tubes: Research on the Processing Technology
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The Research on the Processing Technology of Ti-Ni Shape Memory Alloy Capillary Tubes.
Aluminum Nitride Ceramic Substrates: Factors Affecting Thermal Conductivity
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The affecting factors of Aluminum Nitride Ceramic Substrates' thermal conductivity are microstructure, oxygen impurity content, and sintering aids.
Aluminum Nitride Ceramics-The key to Low-Temperature Sintering is Choosing Effective Sintering Aids
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The key to Low-Temperature Sintering of Aluminum Nitride Ceramics is Choosing Effective Sintering Aids.
Posted by Technical Ceramics 0 Comments views (60)
This article discusses the differences between reaction sintering and pressureless sintering after forming SiC using the PEP 3D printing process.
Comparison of Crucible Performance for OLED Evaporation: Tantalum, Graphite, Boron Nitride
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Material Selection for OLED Evaporation Crucible