This article explores the critical role of silicon nitride substrates in electric vehicle power modules, highlighting their superior thermal conductivity, mechanical strength, and impact on efficiency and reliability.

Fillers transform Thermal Interface Materials by boosting thermal conductivity and reliability, making them critical for efficient heat dissipation in modern electronics.

This article explores innovative approaches to producing Y-ZrO2 ceramics with a focus on process parameters, performance comparison, and practical applications.

In this article, we explore the mechanisms, advantages, process steps, material compatibility, performance outcomes, and future potential of cold sintering for advanced ceramics.

This article explores these key factors affecting the thermal conductivity of aluminum nitride substrates, supported by scientific data, comparisons, and practical considerations for manufacturers seeking to optimize performance.