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Ti-Ni Shape Memory Alloy Capillary Tubes: Research on the Processing Technology
Posted by Blog - Refractory Metals - Heeger Materials 0 Comments views (491)
The Research on the Processing Technology of Ti-Ni Shape Memory Alloy Capillary Tubes.
Aluminum Nitride Ceramic Substrates: Factors Affecting Thermal Conductivity
Posted by Blog - Technical Ceramics - Heeger Materials 0 Comments views (1195)
The affecting factors of Aluminum Nitride Ceramic Substrates' thermal conductivity are microstructure, oxygen impurity content, and sintering aids.
Aluminum Nitride Ceramics-The key to Low-Temperature Sintering is Choosing Effective Sintering Aids
Posted by Blog - Technical Ceramics - Heeger Materials 0 Comments views (1762)
The key to Low-Temperature Sintering of Aluminum Nitride Ceramics is Choosing Effective Sintering Aids.
Posted by Blog - Technical Ceramics - Heeger Materials 0 Comments views (836)
This article discusses the differences between reaction sintering and pressureless sintering after forming SiC using the PEP 3D printing process.
Comparison of Crucible Performance for OLED Evaporation: Tantalum, Graphite, Boron Nitride
Posted by Blog - Deposition Materials - Heeger Materials 0 Comments views (601)
Material Selection for OLED Evaporation Crucible