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Heeger Materials Blog
Ti-Ni Shape Memory Alloy Capillary Tubes: Research on the Processing Technology
Posted by Blog - Refractory Metals - Heeger Materials 0 Comments views (1062)
The Research on the Processing Technology of Ti-Ni Shape Memory Alloy Capillary Tubes.
Aluminum Nitride Ceramic Substrates: Factors Affecting Thermal Conductivity
Posted by Blog - Technical Ceramics - Heeger Materials 0 Comments views (2677)
The affecting factors of Aluminum Nitride Ceramic Substrates' thermal conductivity are microstructure, oxygen impurity content, and sintering aids.
Aluminum Nitride Ceramics-The key to Low-Temperature Sintering is Choosing Effective Sintering Aids
Posted by Blog - Technical Ceramics - Heeger Materials 0 Comments views (5154)
The key to Low-Temperature Sintering of Aluminum Nitride Ceramics is Choosing Effective Sintering Aids.
Posted by Blog - Technical Ceramics - Heeger Materials 0 Comments views (1531)
This article discusses the differences between reaction sintering and pressureless sintering after forming SiC using the PEP 3D printing process.
OLED Evaporation Crucibles: Tantalum vs Graphite vs PBN
Posted by Blog - Deposition Materials - Heeger Materials 0 Comments views (1713)
An engineering comparison of tantalum, graphite and PBN crucibles for OLED vacuum evaporation, covering compatibility, heat transfer, contamination control, geometry, testing and inquiry requirements.