Heeger Materials Blog

A practical guide to ceramic end effectors for semiconductor wafer handling, covering alumina selection, holding and vacuum structures, drawing requirements, inspection and packaging.

From the development of 3D printing technology to the ability to manufacture finished parts, the first industry to benefit from this process is undoubtedly the aerospace field.

We all know that 3D printing is quite popular nowadays, but most people do have many misunderstandings about 3D printing. You may get some answers from this article.

A comprehensive technical overview of boron nitride ceramic properties, detailing thermal conductivity, dielectric strength, machinability, thermal shock resistance, non-wetting behavior with molten metals, and grade selection for high-temperature applications.

At present, there are mainly two preparation methods of high entropy alloy targets: special melting and powder metallurgy.