Spherical Tungsten-Nickel-Iron Alloy Powder Particle Size

15-45μm, 15-53μm, 45-75μm, 45-105μm, 75-150μm(Various granularity can be customized according to customer requirements)

Spherical Tungsten-Nickel-Iron Alloy Powder Characteristics

• High Purity
• Low Oxygen
• High Sphericity
• Smooth Surface
• No Satellite Ball
• Full Density Inside The Particle
• No Hollow Powder
• Uniform Particle Size Distribution
• Excellent Flow Performance
• High Density

Spherical Tungsten-Nickel-Iron Alloy Powder Chemical composition

Particle Size Distribution

• 5-25μm (D10=5~10μm, D50=15~20μm, D90=20~25μm)
• 15-45μm (D10=15~20μm,D50=25~30μm,D90=35~40μm)
• 15-53μm (D10=15~20μm,D50=25~35μm,D90=45~50μm)
• 45-75μm (D10=45~55μm,D50=55~65μm,D90=70~75μm)
• 45-105μm (D10=50~60μm,D50=75~85μm,D90=95~105μm)
• 75-150μm (D10=80~90μm,D50=110~125μm,D90=135~150μm)

It is a single peak normal distribution, and the laser particle size distribution can be referred to in the following figure.

Spherical Tungsten-Nickel-Iron Alloy Powder Surface topography

Spherical Tungsten-Nickel-Iron Alloy Powder Application

Tungsten-nickel-iron alloy is a kind of tungsten matrix, adding the appropriate amount of nickel, and iron composition of the ternary alloy, tungsten content is about 90%~98%, and the mass ratio of nickel and iron is usually 7:3 or 1:1. Radiofrequency plasma spheroidized tungsten-nickel-iron alloy powder has the characteristics of high sphericity, good fluidity, high purity, and large loose density, etc. It can be used in medical instruments, national defense, the nuclear industry, and other fields.

Application Field

Laser/electron beam additive manufacturing (SLM/EBM), laser direct deposition (DLD), powder hot isostatic pressing (HIP), metal injection molding (MIM), powder metallurgy (PM), laser cladding (LC), and other processes.

Spherical Tungsten-Nickel-Iron Alloy Powder Packaging

Vacuum encapsulation, 1kg/bag, 2kg/bag; Iron bucket lined with plastic bag 25 kg/bucket; Special packaging can be made according to customer requirements.