Viewed products
-
Spherical...
Spherical copper-coated tungsten...
Spherical Copper-coated Tungsten (W-Cu) Powder
New product
Spherical copper-coated tungsten powder is often used in 3D printing. Tungsten-copper alloy has the characteristics of high strength, high hardness, low expansion coefficient, and so on. W-Cu composite materials can be used as electronic packaging materials and heat sink materials.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
Data sheet
| Shape | Spherical / Ball Powder |
| Particle Size | 15-45μm, 15-53μm, 45-75μm, 45-105μm, 75-150μm, customized |
| CAS | 12008-30-9 |
| Molecular Formula | SmB6 |
More info
Heeger Materials provides high-quality Spherical Copper-coated Tungsten Powder at a competitive price, which can be used in scientific research or industrial production.
Spherical Copper-coated Tungsten (W-Cu) Powder Particle Size
5-25 μm,15-45μm,15-53μm,45-75μm,45-105μm,75-150μm. Grain sizes can be customized.
Spherical Copper-coated Tungsten (W-Cu) Powder Characteristics
high purity (≥ 99.9%), low oxygen (≤ 1000ppm), high sphericity (≥ 98%), uniform grain distribution, excellent mobility energy (≤10.0s/50g), high loose loading density (≥ 6.0g/cm3)
Spherical Copper-coated Tungsten (W-Cu) Powder Applicable Processes
Laser/electron beam additive manufacturing (SLM/EBM), laser direct deposition (DLD), powder thermal and other static pressure forming (HIP), metal injection forming (MIM), powder metallurgy (PM), laser melting application (LC), etc.
Spherical Copper-coated Tungsten (W-Cu) Powder Application
Spherical Copper-coated Tungsten Powder using tungsten carbide powder as raw material, prepared through the chemical packaging process, with high spherical, good mobility, high purity, loose loading density, metal copper content, coating thickness controllable characteristics, widely used in national defense, petrochemical, mechanical equipment, medical equipment, and other fields.
Spherical Copper-coated Tungsten (W-Cu) Powder Chemical Composition
Chemical Composition | |||||
Element | Value(%) | Test Method | Element | Value(%) | Test Method |
W | Bal | ICP-AES | Sn | <0.001 | ICP-AES |
Cu | 2~20 | ICP-AES | Sb | <0.001 | ICP-AES |
Si | <0.005 | ICP-AES | Ni | <0.005 | ICP-AES |
Mg | <0.005 | ICP-AES | Ca | <0.001 | ICP-AES |
Mn | <0.004 | ICP-AES | Pt | <0.001 | ICP-AES |
Gas Impurities | |||
Element | Value(%) | Element | Value(%) |
C | ≤0.005 | O | ≤0.10 |
N | ≤0.003 | P | ≤0.005 |
Spherical Copper-coated Tungsten (W-Cu) Powder Property
Density(g/cm³) | Hall Flow Rate(s/50g) | |
Apparent Density | Tap Density | Value |
≥6.0 | ≥7.5 | ≤10.0 |
Spherical Copper-coated Tungsten (W-Cu) Powder Particle Size Distribution
Inquiry to Heeger Materials
Items marked with an asterisk (*) are required.
Heeger Materials respects your privacy, and we will NOT sell or provide your personal data to other third parties, or allow them to use your personal data for their own purposes. However, we would like to send you information from time to time by mail or email about our products and special offers in addition to the interest categories you've selected above. Read our Privacy Policy