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Aluminum Sputtering Targets can be...
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Aluminum Sputtering Targets can be used in semiconductors, chemical vapor deposition (CVD), physical vapor deposition (PVD) displays, and optical applications. Heeger Materials is a professional supplier and manufacturer of high-quality Aluminum Sputtering targets, offering competitive prices and customized solutions to meet specific requirements.
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Shape | Disc/Rectangular/Tube |
Bonding | Unbonding/Bonding |
Symbol | Al |
Purity | 99.9% |
Aluminum is a widely used metal found in kitchen utensils, cars, street lights, and aluminum foil. This silvery-white metal is lightweight, malleable, ductile, and non-magnetic, with a density of 2.7 g/cm3, a melting point of 660°C, and a vapor pressure of 10-4 Torr at 1,010°C.
Though not very strong, aluminum is an excellent conductor of heat and electricity and forms a corrosion-resistant oxide layer. Its high reactivity means it rarely occurs in nature as a free element. When evaporated in a vacuum, aluminum creates a reflective coating used in telescopes, car headlights, mirrors, packaging, and toys. It is extensively applied in aerospace, automotive lighting, OLEDs, and optics.
HM provides high-quality Aluminum Sputtering Targets for research and industry purposes at competitive prices. We can provide Aluminum Sputtering targets with different purity, size, and density per your requirements.
Material Type | Aluminum | Coefficient of Thermal Expansion | 23.1 x 10-6/K |
Symbol | Al | Theoretical Density (g/ cm3) | 2.7 |
Atomic Weight | 26.9815386 | Z Ratio | 1.08 |
Atomic Number | 13 | Sputter | DC |
Color/Appearance | Silvery, Metallic | Max Power Density (Watts/Square Inch) | 150* |
Thermal Conductivity | 235 W/m.K | Type of Bond | Indium, Elastomer |
Melting Point (°C) | 660 | Comments | Alloys W/Mo/Ta. Flash Evap or use BN crucible. |
Circular Sputtering Targets | Diameter | 1.0” 2.0” 3.0” 4.0” 5.0” 6.0” up to 21” |
Rectangular Sputtering Targets | Width x Length | 5” x 12” 5” x 15” 5” x 20” 5” x 22” 6” x 20” |
Thickness | 0.125”, 0.25” |
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Sputtering is an established method for depositing thin films from various materials onto substrates of different shapes and sizes. This process, using sputter targets, suits medium to large substrate areas. Based on the process settings, chemical reactions can happen on the target surface, in-flight, or substrate. Aluminum sputtering targets are commonly used for thin film deposition in applications like fuel cells, decoration, semiconductors, displays, and glass coatings
The Lead time of the Aluminum Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.
Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.
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