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Aluminum (Al) Sputtering Target

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Aluminum Sputtering Targets can be used in semiconductors, chemical vapor deposition (CVD), physical vapor deposition (PVD) displays, and optical applications. Heeger Materials is a professional supplier and manufacturer of high-quality Aluminum Sputtering targets, offering competitive prices and customized solutions to meet specific requirements.

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$189.06

  • 99.9%




Data sheet

ShapeDisc/Rectangular/Tube
BondingUnbonding/Bonding
SymbolAl
Purity99.9%

More info

Aluminum is a widely used metal found in kitchen utensils, cars, street lights, and aluminum foil. This silvery-white metal is lightweight, malleable, ductile, and non-magnetic, with a density of 2.7 g/cm3, a melting point of 660°C, and a vapor pressure of 10-4 Torr at 1,010°C.

Though not very strong, aluminum is an excellent conductor of heat and electricity and forms a corrosion-resistant oxide layer. Its high reactivity means it rarely occurs in nature as a free element. When evaporated in a vacuum, aluminum creates a reflective coating used in telescopes, car headlights, mirrors, packaging, and toys. It is extensively applied in aerospace, automotive lighting, OLEDs, and optics. 

HM provides high-quality Aluminum Sputtering Targets for research and industry purposes at competitive prices. We can provide Aluminum Sputtering targets with different purity, size, and density per your requirements. 

Aluminum (Al) Sputtering Target

  • High purity and density
  • Low particle
  • Uniform film thickness distribution
  • High efficiency in the use

Aluminum Sputtering Target Specifications

Material Type

Aluminum

Coefficient of Thermal Expansion

23.1 x 10-6/K

Symbol

Al

Theoretical Density (g/ cm3)

2.7

Atomic Weight

26.9815386

Z Ratio

1.08

Atomic Number

13

Sputter

DC

Color/Appearance

Silvery, Metallic

Max Power Density (Watts/Square Inch)

150*

Thermal Conductivity

235 W/m.K

Type of Bond

Indium, Elastomer

Melting Point (°C)

660

Comments

Alloys W/Mo/Ta. Flash Evap or use BN crucible.

Aluminum Sputtering Target Dimensions

Circular Sputtering Targets

Diameter

1.0”

2.0”

3.0”

4.0”

5.0”

6.0”

up to 21”

Rectangular Sputtering Targets

Width x Length

5” x 12”

5” x 15”

5” x 20”

5” x 22”

6” x 20”

Thickness

0.125”, 0.25”

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Aluminum Sputtering Target Applications

Sputtering is an established method for depositing thin films from various materials onto substrates of different shapes and sizes. This process, using sputter targets, suits medium to large substrate areas. Based on the process settings, chemical reactions can happen on the target surface, in-flight, or substrate. Aluminum sputtering targets are commonly used for thin film deposition in applications like fuel cells, decoration, semiconductors, displays, and glass coatings

Aluminum Sputtering Target Delivery and Packaging

The Lead time of the Aluminum Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.

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