Tin sputtering targets are silver-gray metal targets composed of high-purity tin. Due to its excellent chemical resistance, tin is used as a coating for other metals to prevent corrosion, with the coating of steel sheets for tinplate being a significant application. Tin is widely used in the manufacture of solder, where it forms alloys with other elements to produce solders with various properties. Tin is also a component in bronze, pewter, certain bearing materials, and low-melting-point alloys.

HM provides high-quality Tin Sputtering targets at competitive prices for research and industry purposes. We can provide Tin Sputtering Targets with different purity, size, and density per your requirements.

• High purity and density
• Low particle
• Uniform film thickness distribution
• High efficiency in the use

Tin Sputtering Target Specifications

Tin Sputtering Target Dimensions

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Tin Sputtering Target Applications

Tin Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Tin Sputtering Target Delivery and Packaging

The Lead time of the Tin Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.