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Aluminum Copper (Al/Cu) Sputtering...
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Aluminum Copper (Al/Cu) Sputtering Target can be use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Heeger Materials (HM) specializes in producing high purity Aluminum Copper (Al/Cu) Sputtering Target with the highest possible density and the lowest prices.
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Symbol | Al/Cu |
Purity | 99.9% |
Aluminum Copper (AlCu) Alloy
Aluminum Copper (AlCu) Alloy targets are widely used in semiconductor integrated circuits, solar energy, data storage, glass industry, decorative coating, tool coating and other industries.
Component: Aluminum Copper (Al/Cu, 99/1 wt%) Sputtering Target
AlCu 70/30, AlCu 67/33, AlCu 65/35, AlCu 50/50, AlCu70/30, Custom-Made
We specialize in producing custom compositions for commercial and research applications and for new proprietary technologies. Other sputtering targets, evaporation sources and other deposition materials is listed by material throughout the website.
Other Purity for Aluminum Copper (Al/Cu) Sputtering Target:99.9% - 99.999%
Other Shape for Aluminum Copper (Al/Cu) Sputtering Target: Discs, Plates, Column Targets, Step Targets, Custom-made
Regular Specifications:
Dimensions | Purity | Guns |
1.00" Dia. x 0.063" Thick | 99.5% | Consult Sputter Gun Manual |
1.00" Dia. x 0.125" Thick | 99.95% | Consult Sputter Gun Manual |
1.00" Dia. x 0.250" Thick | 99.95% | Consult Sputter Gun Manual |
2.00" Dia. x 0.063" Thick | 99.5% | Consult Sputter Gun Manual |
2.00" Dia. x 0.125" Thick | 99.5% | Consult Sputter Gun Manual |
2.00" Dia. x 0.125" Thick | 99.95% | Consult Sputter Gun Manual |
2.00" Dia. x 0.250" Thick | 99.95% | Consult Sputter Gun Manual |
3.00" Dia. x 0.063" Thick | 99.5% | Consult Sputter Gun Manual |
3.00" Dia. x 0.125" Thick | 99.5% | Consult Sputter Gun Manual |
3.00" Dia. x 0.125" Thick | 99.95% | Consult Sputter Gun Manual |
3.00" Dia. x 0.250" Thick | 99.95% | Consult Sputter Gun Manual |
4.00" Dia. x 0.063" Thick | 99.5% | Consult Sputter Gun Manual |
4.00" Dia. x 0.125" Thick | 99.5% | Consult Sputter Gun Manual |
57mm Dia. x 1mm Thick | 99.95% | — |
Packing: The Aluminum Copper (Al/Cu) Sputtering Target are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.
Lead time: 2-5 weeks for sputter target, 1-2 weeks for bonding.
Please let us know the Purity and Shape you need and we'll give you feedback in 24 hours.
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