Aluminum Copper (Al/Cu) Sputtering Target

HM provides high-quality Aluminum Copper Sputtering Target for research and industry purposes at competitive prices. We can provide Aluminum Copper Sputtering Target with different purity, size, and density according to your requirements.

• High purity and density
• Low particle
• Uniform film thickness distribution
• High efficiency in the use

Aluminum Copper Sputtering Target Dimensions

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Aluminum Copper Sputtering Target Applications

Aluminum Copper Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Aluminum Copper Sputtering Target Delivery and Packaging

The Lead time of the Aluminum Copper Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.