Sputtering Targets

Viewed products

Aluminum Copper...
Aluminum Copper (Al/Cu) Sputtering...

Blog Categories

Sale!

View larger

Aluminum Copper (Al/Cu) Sputtering Target

Reference:

Condition: New product

Aluminum Copper (Al/Cu) Sputtering Target can be use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Heeger Materials (HM) specializes in producing high purity Aluminum Copper (Al/Cu) Sputtering Target with the highest possible density and the lowest prices.

More details

In Stock

Inquiry
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Send to a friend
Send to a friend

Aluminum Copper (Al/Cu) Sputtering Target
Aluminum Copper (Al/Cu) Sputtering Target can be use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Heeger Materials (HM) specializes in producing high purity Aluminum Copper (Al/Cu) Sputtering Target with the highest possible density and the lowest prices.
Recipient :
Name of your friend ^* :
E-mail address of your friend ^* :
^* Required fields
or Cancel
Print

Data sheet

Symbol	Al/Cu
Purity	99.9%

More info

Aluminum Copper (AlCu) Alloy

Aluminum Copper (AlCu) Alloy targets are widely used in semiconductor integrated circuits, solar energy, data storage, glass industry, decorative coating, tool coating and other industries.

Component: Aluminum Copper (Al/Cu, 99/1 wt%) Sputtering Target

AlCu 70/30, AlCu 67/33, AlCu 65/35, AlCu 50/50, AlCu70/30, Custom-Made

We specialize in producing custom compositions for commercial and research applications and for new proprietary technologies. Other sputtering targets, evaporation sources and other deposition materials is listed by material throughout the website.

Other Purity for Aluminum Copper (Al/Cu) Sputtering Target:99.9% - 99.999%

Other Shape for Aluminum Copper (Al/Cu) Sputtering Target: Discs, Plates, Column Targets, Step Targets, Custom-made

Regular Specifications:

Dimensions	Purity	Guns
1.00" Dia. x 0.063" Thick	99.5%	Consult Sputter Gun Manual
1.00" Dia. x 0.125" Thick	99.95%	Consult Sputter Gun Manual
1.00" Dia. x 0.250" Thick	99.95%	Consult Sputter Gun Manual
2.00" Dia. x 0.063" Thick	99.5%	Consult Sputter Gun Manual
2.00" Dia. x 0.125" Thick	99.5%	Consult Sputter Gun Manual
2.00" Dia. x 0.125" Thick	99.95%	Consult Sputter Gun Manual
2.00" Dia. x 0.250" Thick	99.95%	Consult Sputter Gun Manual
3.00" Dia. x 0.063" Thick	99.5%	Consult Sputter Gun Manual
3.00" Dia. x 0.125" Thick	99.5%	Consult Sputter Gun Manual
3.00" Dia. x 0.125" Thick	99.95%	Consult Sputter Gun Manual
3.00" Dia. x 0.250" Thick	99.95%	Consult Sputter Gun Manual
4.00" Dia. x 0.063" Thick	99.5%	Consult Sputter Gun Manual
4.00" Dia. x 0.125" Thick	99.5%	Consult Sputter Gun Manual
57mm Dia. x 1mm Thick	99.95%	—

Packing: The Aluminum Copper (Al/Cu) Sputtering Target are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.

Lead time: 2-5 weeks for sputter target, 1-2 weeks for bonding.

sputtering-target packing1.jpg supptering-target packing2.jpg

Please let us know the Purity and Shape you need and we'll give you feedback in 24 hours.

Inquiry to Heeger Materials

Items marked with an asterisk (*) are required.

Privacy Information:

Heeger Materials respects your privacy, and we will NOT sell or provide your personal data to other third parties, or allow them to use your personal data for their own purposes. However, we would like to send you information from time to time by mail or email about our products and special offers in addition to the interest categories you've selected above. Read our Privacy Policy