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  5. Aluminum Copper (Al/Cu) Sputtering Target

Sale! Aluminum Copper (Al/Cu) Sputtering Target-Heeger Materials Inc View larger

Aluminum Copper (Al/Cu) Sputtering Target

New product

Aluminum Copper (Al/Cu) Sputtering Target can be use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Heeger Materials (HM) specializes in producing high purity Aluminum Copper (Al/Cu) Sputtering Target with the highest possible density and the lowest prices.

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Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

$160.00

  • 99.9%




Data sheet

SymbolAl/Cu
Purity99.9%

More info

Aluminum Copper (AlCu) Alloy

Aluminum Copper (AlCu) Alloy targets are widely used in semiconductor integrated circuits, solar energy, data storage, glass industry, decorative coating, tool coating and other industries.

Component: Aluminum Copper (Al/Cu, 99/1 wt%) Sputtering Target

AlCu 70/30, AlCu 67/33, AlCu 65/35, AlCu 50/50, AlCu70/30, Custom-Made

We specialize in producing custom compositions for commercial and research applications and for new proprietary technologies. Other sputtering targets, evaporation sources and other deposition materials is listed by material throughout the website.

Other Purity for Aluminum Copper (Al/Cu) Sputtering Target:99.9% - 99.999%

Other Shape for Aluminum Copper (Al/Cu) Sputtering Target: Discs, Plates, Column Targets, Step Targets, Custom-made

Regular Specifications:

Dimensions

Purity

Guns

1.00" Dia. x 0.063" Thick

99.5%

Consult Sputter Gun Manual

1.00" Dia. x 0.125" Thick

99.95%

Consult Sputter Gun Manual

1.00" Dia. x 0.250" Thick

99.95%

Consult Sputter Gun Manual

2.00" Dia. x 0.063" Thick

99.5%

Consult Sputter Gun Manual

2.00" Dia. x 0.125" Thick

99.5%

Consult Sputter Gun Manual

2.00" Dia. x 0.125" Thick

99.95%

Consult Sputter Gun Manual

2.00" Dia. x 0.250" Thick

99.95%

Consult Sputter Gun Manual

3.00" Dia. x 0.063" Thick

99.5%

Consult Sputter Gun Manual

3.00" Dia. x 0.125" Thick

99.5%

Consult Sputter Gun Manual

3.00" Dia. x 0.125" Thick

99.95%

Consult Sputter Gun Manual

3.00" Dia. x 0.250" Thick

99.95%

Consult Sputter Gun Manual

4.00" Dia. x 0.063" Thick

99.5%

Consult Sputter Gun Manual

4.00" Dia. x 0.125" Thick

99.5%

Consult Sputter Gun Manual

57mm Dia. x 1mm Thick

99.95%

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Packing: The Aluminum Copper (Al/Cu) Sputtering Target are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.

Lead time: 2-5 weeks for sputter target, 1-2 weeks for bonding.

  sputtering-target packing1.jpgsupptering-target packing2.jpg

Please let us know the Purity and Shape you need and we'll give you feedback in 24 hours.

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