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Sputtering Targets

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Nickel (Ni) Sputtering Target

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Nickel Sputtering Targets can be used in semiconductors, chemical vapor deposition (CVD), physical vapor deposition (PVD) displays, and optical applications. Heeger Materials is a professional supplier and manufacturer of high-quality Nickel Sputtering targets, offering competitive prices and customized solutions to meet specific requirements.

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Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

$477.00

  • 99.9%




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Data sheet

ShapeDisc/Rectangular/Tube
BondingUnbonding/Bonding
SymbolNi
Purity99.9% - 99.99%

More info

Nickel is a hard, lustrous, silvery-white metal with a density of 8.91 g/cc, a melting point of 1,453°C, and a vapor pressure of 10-4 Torr at 1,262°C. Known for its malleability, ductility, and ferromagnetism, it resists tarnishing and is the second most abundant element in Earth's core after iron.

HM provides high-quality Nickel Sputtering targets for research and industry purposes at competitive prices. We can provide Nickel Sputtering Target with different purity, size, and density per your requirements.

  • High purity and density
  • Low particle
  • Uniform film thickness distribution
  • High efficiency in the use

Nickel (Ni) Sputtering Target Selection Notes

Nickel (Ni) Sputtering Target belongs to the Sputtering Targets range and is selected for controlled material quality, application-specific specifications and reliable supply for research or production use. It is commonly used in thin-film deposition, sputtering, coating development and semiconductor or optical research as well as research, development, specialty manufacturing, laboratory use and industrial material projects. When requesting a quote, confirm purity, diameter or plate size, thickness, density, bonding requirement and backing plate details.

Related Materials and Product Forms

For material comparison or adjacent product forms, browse all products, deposition materials, technical ceramics and Sputtering Targets.

FAQ

What sputtering target specifications are needed? Please provide purity, diameter or plate size, thickness, density, bonding requirement, backing plate material and deposition system.

Nickel Sputtering Target Specifications

Material Type

Nickel

Coefficient of Thermal Expansion

13.4 x 10-6/K

Symbol

Ni

Theoretical Density (g/cc)

8.91

Atomic Weight

58.6934

Ferromagnetic

Magnetic Material

Atomic Number

28

Z Ratio

0.331

Color/Appearance

Lustrous, Metallic, Silvery Tinge

Sputter

DC

Thermal Conductivity

91 W/m.K

Max Power Density (Watts/Square Inch)

50*

Melting Point (°C)

1,453

Comments

Alloys with W/Ta/Mo. Smooth adherent films.

Nickel Sputtering Target Dimensions

Circular Sputtering Targets

Diameter

1.0”

2.0”

3.0”

4.0”

5.0”

6.0”

up to 21”

Rectangular Sputtering Targets

Width x Length

5” x 12”

5” x 15”

5” x 20”

5” x 22”

6” x 20”

Thickness

0.125”, 0.25”

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Nickel Sputtering Target Applications

  • Nickel Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
  • When evaporated in a vacuum, it forms decorative coatings or solder layers and is sputtered for magnetic storage media, fuel cells, and sensors.

Nickel Sputtering Target Delivery and Packaging

The Lead time of the Nickel Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.

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