Bismuth Titanate (Bi4Ti3O12)...
Bismuth Titanate (Bi4Ti3O12) Sputtering Target can be use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Heeger Materials (HM) specializes in producing high purity Bismuth Titanate (Bi4Ti3O12) Sputtering Targets with the highest possible density and the lowest prices.
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Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
We specialize in producing custom compositions for commercial and research applications and for new proprietary technologies. Other sputtering targets, evaporation sources, and other deposition materials are listed by material throughout the website.
Packing: The Bismuth Titanate (Bi4Ti3O12) Sputtering Targets are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.
Lead time: 2-5 weeks for sputter target, 1-2 weeks for bonding.
Please let us know the Purity and Shape you need and we'll give you feedback in 24 hours.