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Tin Fluoride (SnF2) Sputtering Target...
HTST501
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Tin Fluoride (SnF2) Sputtering Target (CAS 7783-47-3) is used for thin-film deposition, optical coatings, semiconductor research and specialty PVD work. Heeger Materials supplies custom purity, diameter or plate size, thickness, density, bonding and vacuum packaging.
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| Shape | Disc/Rectangular/Tube |
| Bonding | Unbonding/Bonding |
| Symbol | SnF2 |
| Purity | 99.9% |
HM provides high-quality Tin Fluoride Sputtering Target for research and industry purposes at competitive prices. We can provide Tin Fluoride Sputtering Target with different purity, size, and density according to your requirements.
Tin Fluoride (SnF2) Sputtering Target is selected by CAS 7783-47-3 material, purity, diameter or plate size, thickness, density, backing plate and bonding requirement. It supports PVD coating development, optical films, semiconductor research and specialty deposition work.
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What target details are needed for a quote? Please provide CAS 7783-47-3 SnF2 target purity, diameter or plate size, thickness, density, backing plate, bonding requirement, quantity and deposition system.
Can Tin Fluoride targets be bonded? Bonding can be discussed based on target size, backing plate material, operating power and deposition system requirements.
Specification note: Order details should include CAS 7783-47-3 SnF2, purity, target shape, diameter or plate size, thickness, density, backing plate, bonding requirement, quantity and MSDS or COA needs.
Circular Sputtering Targets | Diameter | 1.0” 2.0” 3.0” 4.0” 5.0” 6.0” up to 21” |
Rectangular Sputtering Targets | Width x Length | 5” x 12” 5” x 15” 5” x 20” 5” x 22” 6” x 20” |
Thickness | 0.125”, 0.25” | |
General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.
Tin Fluoride Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.
Packaging note: Tin Fluoride targets should be vacuum sealed or moisture protected, with COA/MSDS documentation included when requested.
The Lead time of the Tin Fluoride Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.
Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.
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