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Tin Fluoride (SnF2) Sputtering Target

HTST501

New product

Tin Fluoride (SnF2) Sputtering Target (CAS 7783-47-3) is used for thin-film deposition, optical coatings, semiconductor research and specialty PVD work. Heeger Materials supplies custom purity, diameter or plate size, thickness, density, bonding and vacuum packaging.

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Data sheet

ShapeDisc/Rectangular/Tube
BondingUnbonding/Bonding
SymbolSnF2
Purity99.9%

More info

HM provides high-quality Tin Fluoride Sputtering Target for research and industry purposes at competitive prices. We can provide Tin Fluoride Sputtering Target with different purity, size, and density according to your requirements.

  • High purity and density
  • Low particle
  • Uniform film thickness distribution
  • High efficiency in the use

Tin Fluoride (SnF2) Sputtering Target Selection Notes

Tin Fluoride (SnF2) Sputtering Target is selected by CAS 7783-47-3 material, purity, diameter or plate size, thickness, density, backing plate and bonding requirement. It supports PVD coating development, optical films, semiconductor research and specialty deposition work.

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FAQ

What target details are needed for a quote? Please provide CAS 7783-47-3 SnF2 target purity, diameter or plate size, thickness, density, backing plate, bonding requirement, quantity and deposition system.

Can Tin Fluoride targets be bonded? Bonding can be discussed based on target size, backing plate material, operating power and deposition system requirements.

Tin Fluoride Sputtering Target Dimensions

Specification note: Order details should include CAS 7783-47-3 SnF2, purity, target shape, diameter or plate size, thickness, density, backing plate, bonding requirement, quantity and MSDS or COA needs.

Circular Sputtering Targets

Diameter

1.0”

2.0”

3.0”

4.0”

5.0”

6.0”

up to 21”

Rectangular Sputtering Targets

Width x Length

5” x 12”

5” x 15”

5” x 20”

5” x 22”

6” x 20”

Thickness

0.125”, 0.25”

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Tin Fluoride Sputtering Target Applications

  • Thin-film deposition, PVD coating development and optical coating research.
  • Semiconductor, display and specialty materials research.
  • Laboratory sputtering work requiring custom target dimensions or bonding.

Tin Fluoride Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Tin Fluoride Sputtering Target Delivery and Packaging

Packaging note: Tin Fluoride targets should be vacuum sealed or moisture protected, with COA/MSDS documentation included when requested.

The Lead time of the Tin Fluoride Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.

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