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Sputtering Targets

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Iron Boride (FeB) Sputtering Target

HTST539

New product

Iron Boride (FeB) Sputtering Target is used for PVD thin-film deposition, hard coating research and specialty boride film development. Heeger Materials supplies custom purity, diameter or plate size, thickness, density, backing plate and bonding options.

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Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

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Data sheet

ShapeDisc/Rectangular/Tube
BondingUnbonding/Bonding
SymbolFeB
Purity99.5%

More info

HM provides high-quality Iron Boride Sputtering Target for research and industry purposes at competitive prices. We can provide Iron Boride Sputtering Target with different purity, size, and density according to your requirements.

  • High purity and density
  • Low particle
  • Uniform film thickness distribution
  • High efficiency in the use

Iron Boride (FeB) Sputtering Target Selection Notes

FeB sputtering targets are selected by composition, purity, target size, thickness, density, bonding requirement and deposition system. Confirm backing plate material and process power before ordering.

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Review Sputtering Targets, all products and the materials blog.

FAQ

What should be included in a quote request? Specify FeB composition, purity, shape, diameter or plate size, thickness, density, backing plate, bonding and quantity.

Can specifications and packaging be customized? Yes. Share dimensions, grade, purity or composition, quantity, documentation and packaging requirements so the supply team can confirm feasibility.

Iron Boride Sputtering Target Dimensions

Specification note: Specify FeB composition, purity, shape, diameter or plate size, thickness, density, backing plate, bonding and quantity.

Circular Sputtering Targets

Diameter

1.0”

2.0”

3.0”

4.0”

5.0”

6.0”

up to 21”

Rectangular Sputtering Targets

Width x Length

5” x 12”

5” x 15”

5” x 20”

5” x 22”

6” x 20”

Thickness

0.125”, 0.25”

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Iron Boride Sputtering Target Applications

  • Boride thin films, hard coating development, PVD research and specialty surface engineering.

Iron Boride Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Iron Boride Sputtering Target Delivery and Packaging

Packaging note: Targets should be vacuum sealed or moisture protected, with COA/MSDS documentation when requested.

The Lead time of the Iron Boride Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.

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Please include item quantity, size and purity.
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