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Tungsten Copper Alloy, WCu

HTWW1133

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Tungsten-copper alloy is a pseudo-alloy with a two-phase structure based on tungsten and copper as a sub-composite. Now generally using powder alloy technology for production.

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Data sheet

Materials Tungsten Copper Alloy
Purity 99.9% - 99.99%

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Tungsten copper (WCu) is a composite of tungsten and copper, so both the thermal conductivity advantage of copper and the very low thermal expansion characteristic of tungsten can be utilized. By adjusting the content of tungsten, it is possible to have an appropriate thermal expansion to match with those of silicone (Si), aluminum oxide (A1203), beryllium oxide (BeO), etc. The copper content of commonly used alloys is 10% to 50%. Tungsten copper material has the properties of high density, sweat cooling, high-temperature strength, and erosion resistance. 

Tungsten Copper Alloy Specifications

  • Surface: No coating, electroplated Ni, Ni-Au, or electroless Ni

  • Tungsten Copper Plate: 300mm x 300mm x 0.5-50mm, customized

  • Tungsten Copper Rod: 2-200mm dia. x L, customized

Tungsten Copper Alloy Composition and Properties

Composites

Nominal Composition
 (% Weight)

Density
(g/cm3, ≥)

Electrical Resistivity
 (20°C, µΩ·cm, ≤)

Electrical conductivity
 (IACS%, ≥)

Hardness(≥)
 Brinell Hardness

Bending Strength

Mpa

Kgf/mm2

Mpa

Kgf/mm2

CuW50

50% Copper
 50% Tungsten

11.85

3.2

54

1128

115

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CuW55

45% Copper
 55% Tungsten

12.3

3.5

49

1226

125

---

---

CuW60

40% Copper
 60% Tungsten

12.75

3.7

47

1373

140

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CuW65

35% Copper
 65% Tungsten

13.3

3.9

44

1520

155

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CuW70

30% Copper
 70% Tungsten

13.8

4.1

42

1716

175

667

68

CuW75

25% Copper
 75% Tungsten

14.5

4.5

38

1912

195

706

72

CuW80

20% Copper
 80% Tungsten

15.15

5.0

34

2158

220

736

75

CuW85

15% Copper
 85% Tungsten

15.9

5.7

30

2354

240

765

78

CuW90

10% Copper
 90% Tungsten

16.75

6.5

27

2550

260

804

82

We also provide Tungsten Carbide Copper and Tungsten Carbide Silver.

Tungsten Copper Alloy Applications

Tungsten copper heat sinks are extensively used as thermal mounting plates, chip carriers, flanges, and frames for RF and microwave packages, laser diode packages, and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

  • High-performance materials for aerospace
  • Vacuum contact material
  • Electrodes for EDM
  • Electronic packaging materials and heat sink materials
  • Heat Spreader Materials

Tungsten Copper Alloy Packing

Our Tungsten Copper Composites are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

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