Sputtering Targets

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Tungsten (W) Sputtering Target

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Condition: New product

Tungsten Sputtering Targets can be used in semiconductors, chemical vapor deposition (CVD), physical vapor deposition (PVD) display, and optical applications. Heeger Materials is a professional supplier and manufacturer of high-quality Tungsten Sputtering targets, offering competitive prices and customized solutions to meet specific requirements.

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Inquiry

Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Data sheet

Shape	Disc/Rectangular/Tube
Bonding	Unbonding/Bonding
Symbol	W
Purity	99.9%

More info

Tungsten, or Wolfram, is one of the densest elements, with a density of 19.3 g/cc, a melting point of 3,410°C, and a vapor pressure of 10^-4 Torr at 2,757°C. Lustrous and grayish-white, it has the highest melting point of all metals and is very hard to machine and forge. Tungsten is used in electric filaments and its carbide is employed in drills, saws, and jewelry. It is also evaporated under a vacuum to produce semiconductors, fuel cells, and sensors.

HM provides high-quality Tungsten Sputtering Targets for research and industry purposes at competitive prices. We can provide a Tungsten Sputtering Target with different purity, size, and density per your requirements.

High purity and density
Low particle
Uniform film thickness distribution
High efficiency in the use

Tungsten Sputtering Target Specifications

Material Type	Tungsten	Coefficient of Thermal Expansion	4.5 x 10^-6/K
Symbol	W	Theoretical Density (g/cc)	19.25
Atomic Weight	183.84	Z Ratio	0.163
Atomic Number	74	Sputter	DC
Color/Appearance	Grayish White, Lustrous, Metallic	Max Power Density (Watts/Square Inch)	100*
Thermal Conductivity	174 W/m.K	Type of Bond	Indium, Elastomer
Melting Point (°C)	3,410	Comments	Forms volatile oxides. Films are hard and adherent.

Tungsten Sputtering Target Dimensions

Circular Sputtering Targets

Diameter

1.0”

2.0”

3.0”

4.0”

5.0”

6.0”

up to 21”

Rectangular Sputtering Targets

Width x Length

5” x 12”

5” x 15”

5” x 20”

5” x 22”

6” x 20”

Thickness

0.125”, 0.25”

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Tungsten Sputtering Target Applications

Tungsten Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

Tungsten Sputtering Target Delivery and Packaging

The Lead time of the Tungsten Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.

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