Sputtering Targets

Heeger Materials Inc is a supplier of high-purity sputtering targets. Included pure metal and alloy, oxides, fluorides, and nitrides, as well as customized targets. Available in many sizes, purities, and compositions at a competitive price.

We will contact you with the price and availability of these items in 24 hours.

Heeger Materials Inc is a supplier of high-purity sputtering targets. Included pure metal and alloy, oxides, fluorides, and nitrides, as well as customized targets. Available in many sizes, purities, and compositions at a competitive price.

We will contact you with the price and availability of these items in 24 hours.

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Sputtering Targets There are 339 products.

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Showing 1 - 12 of 339 items

Sputtering Targets Description

Spluttering is one of the main techniques for preparing thin-film materials, which uses ions generated by ion sources to form high-velocity ion beams through accelerated aggregation in a vacuum, pounding the solid surface and undergoing kinetic energy exchange, making the yard of the solid surface leave the solid and deposit on the substrate surface. The bombarded solids are raw materials for the deposited thin film by a sputtering method, called sputtering targets.

Sputtering Targets Performance

The target material restricts the physical and mechanical properties of the sputtered film and affects the quality of the coating.

  1. Low impurity content, high purity.
  2. High density.
  3. Uniform composition and organization.
  4. Small grain size.

Sputtering Targets Preparation Process

  • Casting. Melt the alloy raw material with certain ratio, then pour the alloy melt into the mold to form the ingot, and finally make the target by mechanical processing.
  • Powder metallurgy. A certain proportion of alloy raw materials will be melted, cast into ingots and then crushed, the crushed powder formed by isostatic pressing, and then high-temperature sintering, and finally formed the target material.

Sputtering Targets Classify

According to the types of materials, there are many classification methods for target materials, including metal and alloy targets, inorganic nonmetallic targets, and composite targets. Inorganic nonmetallic targets are divided into oxides, slides, nitride, and fluoride.

According to the application of the sputtering target, it can be divided into semiconductor fields, sputtering targets for recording media, sputtering targets for display films, optical targets, superconducting targets, etc.