Spherical molybdenum powder is widely...
Spherical molybdenum powder is widely used in plasma surface spray welding of high-speed wear-resistant parts of aerospace and automobile engines, precision molding of electronic components, high-performance targets and 3D. It is a large class of special molybdenum powder products with high added value and high technical content prepared from powder metallurgy molybdenum powder.
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|Shape||Spherical / Ball Powder|
|Particle Size||15-45μm, 15-53μm, 45-75μm, 45-105μm, 75-150μm, customized|
We provide spherical molybdenum powder with the characteristics of high purity, low oxygen, high sphericity, smooth surface, no satellite sphere, few hollow particles, and uniform particle size distribution. With its excellent flow performance as well as high loose loading density and vibrational density, spherical molybdenum powder is widely used in contact materials, aerospace high-temperature resistant components, target materials, and other fields, and it is also suitable for laser/electron beam augmentation (3 D printing), laser direct deposition, thermal isostatic pressing, injection molding, laser cladding, and other processes.
5-25μm, 15-45μm, 15-53μm, 45-75μm, 45-105μm, 75-150μm. (Various granularities can be customized according to customer requirements)
High purity (≥99.9%), low oxygen (≤200ppm), high sphericity (≥98%), smooth surface, no satellite spheres, uniform particle size distribution, and excellent flow properties (≤12.0s/ 50g), And high bulk density (≥6.0g/cm3) and tap density (≥6.5g/cm3).
Laser/electron beam additive manufacturing (SLM/EBM，3D printing), laser direct deposition (DLD), powder hot isostatic pressing (HIP), metal injection molding (MIM), powder metallurgy (PM), laser cladding (LC), and other processes.
RF plasma spheroidized molybdenum powder has the characteristics of high sphericity, good fluidity, high purity, large loose packing density, full density inside the particles, no hollow powder, etc., widely used in thermal spraying, powder metallurgy, and bonding in the electronics industry Materials, high-temperature aircraft parts, targets, etc.
Chemical Composition - by ICP-AES
Hall Flow Rate (s/50g)
Vacuum packaging, 1kg/bag, 2kg/bag, iron drum lined with plastic bag 25 kg/drum; special packaging is available according to user requirements.