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Ruthenium (Ru) Sputtering Target

HTST307

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Ruthenium Sputtering Target can be used in semiconductor, chemical vapor deposition (CVD), physical vapor deposition (PVD) display, and optical applications. We are a supplier of high-quality Ruthenium Sputtering Target at competitive prices.

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Data sheet

ShapeDisc/Rectangular/Tube
BondingUnbonding/Bonding
Density12.3 g/cc
Melting Piont2,310°C
AppearanceSilvery White Metallic
SymbolRu
Molecular Weight101.07 g/mol
Purity99.9% - 99.95%

More info

Ruthenium (Ru) Sputtering Targets are important for thin film deposition. They offer high purity and steady sputtering rates for even, uniform coatings. They are known for their strong resistance to corrosion and work well in tough conditions. They stick well to different substrates and make strong, high-quality films. Ruthenium Sputtering Targets are used in electronics, data storage, and sensors. They help improve thin film technology

Ruthenium (Ru) Sputtering Target

Ruthenium Sputtering Target Specifications

Material Type

Ruthenium

Symbol

Ru

Atomic Weight

101.07

Atomic Number

44

Color/Appearance

Silvery White Metallic

Thermal Conductivity

120 W/m.K

Melting Point (°C)

2,310

Coefficient of Thermal Expansion

6.4 x 10-6/K

Theoretical Density (g/cc)

12.3

Z Ratio

0.182

Sputter

DC

Max Power Density
(Watts/Square Inch)

100*

Type of Bond

Indium, Elastomer

Ruthenium Sputtering Target Dimensions

Circular Sputtering Targets

Diameter

1.0”

2.0”

3.0”

4.0”

5.0”

6.0”

up to 21”

Rectangular Sputtering Targets

Width x Length

5” x 12”

5” x 15”

5” x 20”

5” x 22”

6” x 20”

Thickness

0.125”, 0.25”

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Ruthenium (Ru) Sputtering Targets Benefits

  • High purity and density
  • Low particle
  • Uniform film thickness distribution
  • High efficiency in the use

Ruthenium Sputtering Target Applications

  • Semiconductor Manufacturing: Ruthenium Sputtering Targets are used to make thin films for semiconductor parts, like interconnects and capacitors, to improve performance.
  • Data Storage: They are used for thin films in hard drives and magnetic storage devices. This increases storage and reliability.
  • Catalysis: Ruthenium Sputtering Targets make thin films for catalytic processes, like hydrogenation, because they work well as catalysts.
  • Sensors: These targets are used for thin films in sensors, like gas and temperature sensors, for accurate readings.
  • Optical Coatings: Ruthenium Sputtering Targets are used for thin films on mirrors and lenses to make them stronger and work better.

Ruthenium Sputtering Target Delivery and Packaging

The Lead time of the Ruthenium Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.

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